参数资料
| 型号： | PCX7447AVGH1000NB |
| 厂商： | Atmel |
| 文件页数： | 4/52页 |
| 文件大小： | 0K |
| 描述： | IC MPU 32BIT 1000MHZ 360CBGA |
| 标准包装： | 44 |
| 处理器类型： | PowerPC 32-位 RISC |
| 速度： | 1.0GHz |
| 电压： | 1.1V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 360-CBBGA 裸露焊盘 |
| 供应商设备封装： | 360-CBGA（25x25） |
| 包装： | 托盘 |
第1页第2页第3页当前第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页
12
0833E–HIREL–01/07
PC7447A
e2v semiconductors SAS 2007
Figure 6-2.
C4 Package with Heat Sink Mounted to a Printed-Circuit Board
Note the internal versus external package resistance.
Heat generated on the active side of the chip is conducted through the silicon, through the heat sink
attach material (or thermal interface material), and finally to the heat sink where it is removed by forced-
air convection.
Because the silicon thermal resistance is quite small, the temperature drop in the silicon may be
neglected for a first-order analysis. Thus, the thermal interface material and the heat sink conduc-
tion/convective thermal resistances are the dominant terms.
6.4.3
Thermal Management Information
This section provides thermal management information for the high coefficient of the thermal expansion
ceramic ball grid array (HITCE) package for air-cooled applications. Proper thermal control design is pri-
marily dependent on the system-level design – the heat sink, airflow, and thermal interface material. The
PC7447A implements several features designed to assist with thermal management, including DFS and
the temperature diode. DFS reduces the power consumption of the device by reducing the core fre-
quency; see Table 6-6 on page 19 for specific information regarding power reduction and DFS. The
temperature diode allows an external device to monitor the die temperature in order to detect excessive
temperature conditions and alert the system; see section “Temperature Diode” on page 16 for more
information.
To reduce the die-junction temperature, heat sinks may be attached to the package by several methods
– spring clips to holes in the printed-circuit board or package, and mounting clips and screw assembly
(see Figure 6-3); however, due to the potentially large mass of the heat sink, attachment through the
printed-circuit board is suggested. If a spring clip is used, the spring force should not exceed ten pounds.
External Resistance
Internal Resistance
Radiation
Convection
Heat Sink
Thermal Interface Material
Die/Package
Die Junction
Package/Leads
Printed-Circuit Board
Radiation
Convection
相关PDF资料 |
PDF描述 |
|---|---|
| IDT70V07L55J8 | IC SRAM 256KBIT 55NS 68PLCC |
| IDT7007L55J8 | IC SRAM 256KBIT 55NS 68PLCC |
| ASC19DTEN | CONN EDGECARD 38POS .100 EYELET |
| ASC19DTEH | CONN EDGECARD 38POS .100 EYELET |
| AMC18DTEN | CONN EDGECARD 36POS .100 EYELET |
相关代理商/技术参数 |
参数描述 |
|---|---|
| PCX7447AVGH1167NB | 功能描述:IC MPU 32BIT 1167MHZ 360CBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:- 标准包装:60 系列:SCC 处理器类型:Z380 特点:全静电 Z380 CPU 速度:20MHz 电压:5V 安装类型:表面贴装 封装/外壳:144-LQFP 供应商设备封装:144-LQFP 包装:托盘 |
| PCX7448MGH1000NC | 制造商:e2v technologies 功能描述:MPU RISC 32BIT 0.09UM 1GHZ 1.5V/1.8V/2.5V 360HITCE CBGA - Trays |
| PCX7448MGH1250NC | 制造商:e2v technologies 功能描述:PCX7448MGH1250NC - Trays |
| PCX7448VGH1000NC | 制造商:e2v technologies 功能描述:PCX7448VGH1000NC - Trays |
| PCX7448VGH1250NC | 制造商:e2v technologies 功能描述:MPU RISC 32BIT 0.09UM 1.25GHZ 1.5V/1.8V/2.5V 360HITCE CBGA - Trays |
发布紧急采购，3分钟左右您将得到回复。