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参数资料
| 型号： | PF38F1020WYTQ1 |
| 厂商： | INTEL CORP |
| 元件分类： | 存储器 |
| 英文描述： | SPECIALTY MEMORY CIRCUIT, PBGA88 |
| 封装： | 8 X 10 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, SCSP-88 |
| 文件页数： | 1/23页 |
| 文件大小： | 364K |
| 代理商： | PF38F1020WYTQ1 |
Order Number: 252635, Revision: 003
28 Jun 2005
Intel Wireless Flash Memory (W18 SCSP)
32-Mbit W18 + 8-Mbit SRAM (38F1020W0YTQ1, 38F1020W0YBQ1)
Datasheet
Product Features
This datasheet describes the key features of the Intel
Wireless Flash Memory (W18 SCSP) device.
This device stacks a wireless flash memory device (W18) in combination with a low-power 8-Mbit
SRAM device, into a versatile and compact Stacked Chip Scale Package (SCSP). The 32-Mbit W18
+ 8-Mbit SRAM combination device described in this document provides a solution for
high-performance, low-power, board-constrained memory applications. . Refer to the latest revision
of the Intel
Wireless Flash Memory (W18) Datasheet (order number 290701) for flash device
details not provided in this document.
■
Flash Architecture
— Flexible, Multi-Partition, Dual-Operation:
Read-While-Write / Read-While-Erase
— 8 Partitions, 4 Mbits each
— 7 Main Partitions, 8 Main Blocks each
— 1 Parameter Partition, 8 Parameter + 7 Main
Blocks
— 32-KWord Main Blocks, 4-KWord
Parameter Blocks
— Top and Bottom Parameter Configuration
■
Flash Performance
— 65 ns Initial Access Speed
— 25 ns Page-Mode Read Speed; 4-Word Page
— 14 ns Burst-Mode Read Speed
— 4-, 8-, 16- or Continuous-Word Burst Modes
— Burst- and Page-Mode Reads in Parameter
and Main Partitions
—Burst Suspend
— Burst-Mode Reads can Traverse Partition
Boundaries
— Programmable WAIT Polarity
— Enhanced Factory Programming: 3.1 s/
Word (typ)
■
Flash Data Protection
— Absolute Protection with VPP and WP#
— Individual Dynamic Zero-Latency Block
Locking
— Individual Block Lock-Down
— Erase/Program Lockout during Power
Transitions
■
Flash Protection Register
— 64 Unique Device Identifier Bits
— 64 User-Programmable OTP Bits
■
Flash Automation Suspend Operations
— Erase Suspend to Program or Read
— Program Suspend to Read
— 5 s (typ) Program/Erase Suspend Latency
■
Flash Software
—Intel
Flash Data Integrator (Intel FDI)
Optimized
— Common Flash Interface (CFI)
■
SCSP Architecture
— 32-Mbit Flash die + 8-Mbit SRAM die
— Reduces Board Space Requirement
— Simplifies PCB Design Complexity
— Easy Migration to Future SCSP Devices
■
SCSP Voltage
— 1.7 V to 1.95 V VCC/VCCQ and S-VCC
■
SCSP Packaging
— 0.8 mm Ball-Pitch Intel
SCSP
— Area: 8x10 mm, Height: 1.2 mm max
— 88-Ball (8 x 10 Matrix): 80 Active Balls with
2 Support Balls at Each Corner
■
SRAM Architecture and Performance
— 70 ns Access Time
— Low-Voltage Data Retention Mode
■
Flash Quality and Reliability
— Extended Temperature: –25 °C to +85 °C
— Minimum 100,000 Block Erase Cycles
—Intel
0.13 m ETOXTM VIII Process
Technology
-
Notice: This document contains information available at the time of its release. The
specifications are subject to change without notice. Verify with your local Intel sales office that
you have the latest datasheet before finalizing a design.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| PF38F1030W0YBQFA | 制造商:Micron Technology Inc 功能描述:32X/16PS SCSP 1.8 LF WINBOND - Trays |
| PF38F1030W0YBQFB | 制造商:Micron Technology Inc 功能描述:32X/16PS SCSP 1.8 LF WINBOND - Tape and Reel |
| PF38F1030W0YCQEA | 制造商:Micron Technology Inc 功能描述:32X/16PS SCSP 1.8 LF - Trays |
| PF38F1030W0YTQFA | 制造商:Micron Technology Inc 功能描述:32X/16PS SCSP 1.8 LF WINBOND - Trays |
| PF38F1030W0YTQFB | 制造商:Micron Technology Inc 功能描述:32X/16PS SCSP 1.8 LF WINBOND - Tape and Reel |
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