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参数资料
| 型号： | PF38F1020WYTQ1 |
| 厂商： | INTEL CORP |
| 元件分类： | 存储器 |
| 英文描述： | SPECIALTY MEMORY CIRCUIT, PBGA88 |
| 封装： | 8 X 10 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, SCSP-88 |
| 文件页数： | 4/23页 |
| 文件大小： | 364K |
| 代理商： | PF38F1020WYTQ1 |
32-Mbit W18 + 8-Mbit SRAM (38F1020W0YTQ1, 38F1020W0YBQ1)
28 Jun 2005
Intel StrataFlash Wireless Memory (W18 SCSP)
Datasheet
12
Order Number: 252635, Revision: 003
5.3
Capacitance
VPP1
Flash Memory Program Logic Level
0.9
1.95
V
VPP2
Flash Memory Factory Program Voltage
11.4
12.6
V
S-VCC
SRAM Supply Voltage
1.7
1.95
V
Symbol
Parameter
Typ
Max
Unit
Condition
CIN
Input Capacitance, Flash Memory Device
(CE#1, OE#1, WE#, RST#, WP#, ADV#, CLK,
A[20:19])
68
pF
VIN = 0.0 V
CIN
Input Capacitance, SRAM
(S-CS#1, S-CS2, R-OE#, R-WE#, R-UB#, R-
LB#)
10
pF
VIN = 0.0 V
CIN
Input Capacitance, Flash Memory and SRAM
(A[18:0])
16
18
pF
VIN = 0.0 V
COUT
Output Capacitance, Flash Memory and SRAM
(D[15:0])
18
22
pF
VOUT = 0.0 V
COUT
Output Capacitance, Flash Memory Device
(WAIT)
812
pF
VOUT = 0.0 V
Note:
Sampled, not 100% tested. TA = +25 °C, f = 1 MHz.
Table 3.
Temperature and Voltage Operating Conditions (Sheet 2 of 2)
Symbol
Parameter
Min
Max
Unit
Test Condition
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相关代理商/技术参数 |
参数描述 |
|---|---|
| PF38F1030W0YBQFA | 制造商:Micron Technology Inc 功能描述:32X/16PS SCSP 1.8 LF WINBOND - Trays |
| PF38F1030W0YBQFB | 制造商:Micron Technology Inc 功能描述:32X/16PS SCSP 1.8 LF WINBOND - Tape and Reel |
| PF38F1030W0YCQEA | 制造商:Micron Technology Inc 功能描述:32X/16PS SCSP 1.8 LF - Trays |
| PF38F1030W0YTQFA | 制造商:Micron Technology Inc 功能描述:32X/16PS SCSP 1.8 LF WINBOND - Trays |
| PF38F1030W0YTQFB | 制造商:Micron Technology Inc 功能描述:32X/16PS SCSP 1.8 LF WINBOND - Tape and Reel |
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