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| 型号： | RK80532PG072512 |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 2800 MHz, MICROPROCESSOR, PGA478 |
| 封装： | FLIP CHIP, MICRO, PGA-478 |
| 文件页数： | 62/79页 |
| 文件大小： | 2634K |
| 代理商： | RK80532PG072512 |
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Intel Pentium 4 Processor on 90 nm Process Datasheet
65
Thermal Specifications and Design Considerations
5.2
Processor Thermal Features
5.2.1
Thermal Monitor
The Thermal Monitor feature helps control the processor temperature by activating the TCC when
the processor silicon reaches its maximum operating temperature. The TCC reduces processor
power consumption as needed by modulating (starting and stopping) the internal processor core
clocks. The Thermal Monitor feature must be enabled for the processor to be operating
within specifications. The temperature at which Thermal Monitor activates the thermal control
circuit is not user configurable and is not software visible. Bus traffic is snooped in the normal
manner, and interrupt requests are latched (and serviced during the time that the clocks are on)
while the TCC is active.
When the Thermal Monitor feature is enabled and a high temperature situation exists (i.e., TCC is
active), the clocks are modulated by alternately turning the clocks off and on at a duty cycle
specific to the processor (typically 30–50%). Clocks often will not be off for more than
3.0 microseconds when the TCC is active. Cycle times are processor speed dependent and decrease
as processor core frequencies increase. A small amount of hysteresis has been included to prevent
rapid active/inactive transitions of the TCC when the processor temperature is near its maximum
operating temperature. Once the temperature has dropped below the maximum operating
temperature and the hysteresis timer has expired, the TCC goes inactive and clock modulation
ceases.
With a properly designed and characterized thermal solution, it is anticipated that the TCC would
only be activated for very short periods of time when running the most power intensive
applications. The processor performance impact due to these brief periods of TCC activation is
expected to be so minor that it would be immeasurable. An under-designed thermal solution that is
not able to prevent excessive activation of the TCC in the anticipated ambient environment may
cause a noticeable performance loss, and in some cases may result in a T
C that exceeds the
specified maximum temperature and may affect the long-term reliability of the processor. In
addition, a thermal solution that is significantly under-designed may not be capable of cooling the
processor, even when the TCC is active continuously. Refer to the Intel Pentium 4 Processor on
90 nm Process Thermal Design Guidelines for information on designing a thermal solution.
The duty cycle for the TCC, when activated by the Thermal Monitor, is factory configured and
cannot be modified. The Thermal Monitor does not require any additional hardware, software
drivers, or interrupt handling routines.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| RK80532PG072512S L6WJ | 制造商:Intel 功能描述:MPU Pentium 制造商:Intel 功能描述:MPU Pentium? 4 Processor 64-Bit 0.13um 2.8GHz 478-Pin FCPGA2 |
| RK80532PG080512 | 制造商:Intel 功能描述:P4 3.0GHZ 800MHZ FSB - Trays |
| RK80532PG080512SL6WK | 制造商:Intel 功能描述:MPU Pentium? 4 Processor NetBurst 64-Bit 0.13um 3GHz 478-Pin FCPGA2 |
| RK80532PG0882M | 制造商:Intel 功能描述:MPU PENTIUM 4 PROCESSOR NETBURST 64-BIT 0.13UM 3.2GHZ 478-P - Trays |
| RK80532PG096512 | 制造商:Intel 功能描述:MPU PENTIUM 4 PROCESSOR NETBURST 64-BIT 0.13UM 3.4GHZ - Trays |
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