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参数资料
型号： S71GL064A04BAI0B3
厂商： Spansion Inc.
英文描述： Stacked Multi-Chip Product (MCP) Flash Memory and RAM
中文描述： 堆叠式多芯片产品（MCP）的闪存和RAM
文件页数： 17/102页
文件大小： 1606K
代理商： S71GL064A04BAI0B3
March 31, 2005 S71GL032A_00_A0
S71GL032A Based MCPs
21
Advance
Informatio n
Device Bus Operations
This section describes the requirements and use of the device bus operations,
which are initiated through the internal command register. The command register
itself does not occupy any addressable memory location. The register is a latch
used to store the commands, along with the address and data information
needed to execute the command. The contents of the register serve as inputs to
the internal state machine. The state machine outputs dictate the function of the
device. Table 1 lists the device bus operations, the inputs and control levels they
require, and the resulting output. The following subsections describe each of
these operations in further detail.
Table 1. Device Bus Operations
Legend: L = Logic Low = VIL, H = Logic High = VIH, VID = 11.5–12.5 V, VHH = 11.5–12.5 V, X = Don’t Care, SA = Sector
Address, AIN = Address In, DIN = Data In, DOUT = Data Out
Notes:
1. Addresses are Amax:A0 in word mode; Amax:A-1 in byte mode. Sector addresses are Amax:A15 in both modes.
2. The sector protect and sector unprotect functions may also be implemented via programming equipment. See the
“Sector Group Protection and Unprotection” section.
3. If WP# = VIL, the first or last sector remains protected (for uniform sector devices), and the two outer boot sectors
are protected (for boot sector devices). If WP# = VIH, the first or last sector, or the two outer boot sectors will be
protected or unprotected as determined by the method described in “Sector Group Protection and Unprotection”.
All sectors are unprotected when shipped from the factory (The Secured Silicon Sector may be factory protected
depending on version ordered.)
4. DIN or DOUT as required by command sequence, data polling, or sector protect algorithm (see Figure 7).
Operation
CE# OE# WE# RESET#
WP#
ACC
Addresses
(Note 1)
DQ0–
DQ7
DQ8–DQ15
BYTE#
= VIH
BYTE#
= VIL
Read
L
H
X
AIN
DOUT
DQ8–DQ14
= High-Z,
DQ15 = A-1
Write (Program/Erase)
L
H
L
H
(Note 3)
X
AIN
(Note 4)
(Note
4)
Accelerated Program
L
H
L
H
(Note 3) VHH
AIN
(Note 4)
(Note
4)
Standby
VCC ±
0.3 V
XX
VCC ±
0.3 V
X
H
X
High-Z
Output Disable
L
H
X
High-Z
Reset
X
L
X
High-Z
Sector Group Protect
(Note 2)
LH
L
VID
HX
SA, A6 =L,
A3=L, A2=L,
A1=H, A0=L
(Note 4)
X
Sector Group
Unprotect
(Note 2)
LH
L
VID
HX
SA, A6=H,
A3=L, A2=L,
A1=H, A0=L
(Note 4)
X
Temporary Sector
Group Unprotect
XX
X
VID
HX
AIN
(Note 4)
(Note
4)
High-Z
相关PDF资料
PDF描述
S71GL064A04BAI0F3 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A04BAW0B3 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A04BAW0F3 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A04BFI0B2 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A04BFI0B3 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
相关代理商/技术参数
参数描述
S71GL064A04BAI0F0 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A04BAI0F2 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A04BAI0F3 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A04BAW0B0 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A04BAW0B2 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
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