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| 型号： | S71GL064A04BAI0B3 |
| 厂商： | Spansion Inc. |
| 英文描述： | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| 中文描述： | 堆叠式多芯片产品（MCP）的闪存和RAM |
| 文件页数： | 49/102页 |
| 文件大小： | 1606K |
| 代理商： | S71GL064A04BAI0B3 |
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50
S71GL032A Based MCPs
S71GL032A_00_A0 March 31, 2005
Advance
Info rmation
Note:See Table 22 for program command sequence.
Figure 4. Program Operation
Program Suspend/Program Resume Command Sequence
The Program Suspend command allows the system to interrupt a programming
operation or a Write to Buffer programming operation so that data can be read
from any non-suspended sector. When the Program Suspend command is written
during a programming process, the device halts the program operation within 15
s maximum (5s typical) and updates the status bits. Addresses are not re-
quired when writing the Program Suspend command.
After the programming operation has been suspended, the system can read array
data from any non-suspended sector. The Program Suspend command may also
be issued during a programming operation while an erase is suspended. In this
case, data may be read from any addresses not in Erase Suspend or Program
Suspend. If a read is needed from the Secured Silicon Sector area (One-time Pro-
gram area), then user must use the proper command sequences to enter and exit
this region. Note that the Secured Silicon Sector, autoselect, and CFI functions
are unavailable when a program operation is in progress.
The system may also write the autoselect command sequence when the device
is in the Program Suspend mode. The system can read as many autoselect codes
as required. When the device exits the autoselect mode, the device reverts to the
Program Suspend mode, and is ready for another valid operation. See Autoselect
Command Sequence for more information.
START
Write Program
Command Sequence
Data Poll
from System
Verify Data?
No
Yes
Last Address?
No
Yes
Programming
Completed
Increment Address
Embedded
Program
algorithm
in progress
相关PDF资料 |
PDF描述 |
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| S71GL064A04BAI0F3 | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A04BAW0B3 | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A04BAW0F3 | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A04BFI0B2 | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A04BFI0B3 | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
相关代理商/技术参数 |
参数描述 |
|---|---|
| S71GL064A04BAI0F0 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A04BAI0F2 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A04BAI0F3 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A04BAW0B0 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A04BAW0B2 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
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