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参数资料
| 型号： | S71GL064A04BAI0B3 |
| 厂商： | Spansion Inc. |
| 英文描述： | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| 中文描述： | 堆叠式多芯片产品（MCP）的闪存和RAM |
| 文件页数： | 40/102页 |
| 文件大小： | 1606K |
| 代理商： | S71GL064A04BAI0B3 |
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42
S71GL032A Based MCPs
S71GL032A_00_A0 March 31, 2005
Advance
Info rmation
Table 20. Device Geometry Definition
Addresses
(x16)
Data
Description
27h
00xxh
Device Size = 2N byte
0017h = 64 Mb, 0016h = 32Mb
28h
29h
000xh
0000h
Flash Device Interface description (refer to CFI publication 100)
0000h = x8-only bus devices
0001h = x16-only bus devices
0002h = x8/x16 bus devices
2Ah
2Bh
0005h
0000h
Max. number of byte in multi-byte write = 2N
(00h = not supported)
2Ch
00xxh
Number of Erase Block Regions within device (01h = uniform device,
02h = boot device)
2Dh
2Eh
2Fh
30h
00xxh
000xh
00x0h
000xh
Erase Block Region 1 Information
(refer to the CFI specification or CFI publication 100)
007Fh, 0000h, 0020h, 0000h = 32 Mb (-R1, -R2)
003Fh, 0000h, 0001h = 32 Mb (-R3, R4)
007Fh, 0000h, 0020h, 0000h = 64 Mb (-R1, -R2, -R8, -R9)
007Fh, 0000h, 0000h, 0001h = 64 Mb (-R3, -R4, -R5, -R6, -R7)
31h
32h
33h
34h
00xxh
0000h
000xh
Erase Block Region 2 Information (refer to CFI publication 100)
003Eh, 0000h, 0000h, 0001h = 32 Mb (-R1, -R2)
007Eh, 0000h, 0000h, 0001h = 64 Mb (-R1, -R2, -R8, -R9)
0000h, 0000h, 0000h, 0000h = all others
35h
36h
37h
38h
0000h
Erase Block Region 3 Information (refer to CFI publication 100)
39h
3Ah
3Bh
3Ch
0000h
Erase Block Region 4 Information (refer to CFI publication 100)
相关PDF资料 |
PDF描述 |
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| S71GL064A04BAI0F3 | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A04BAW0B3 | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A04BAW0F3 | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A04BFI0B2 | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A04BFI0B3 | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
相关代理商/技术参数 |
参数描述 |
|---|---|
| S71GL064A04BAI0F0 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A04BAI0F2 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A04BAI0F3 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A04BAW0B0 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A04BAW0B2 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
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