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参数资料
| 型号： | S71GL064A04BAI0B3 |
| 厂商： | Spansion Inc. |
| 英文描述： | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| 中文描述： | 堆叠式多芯片产品（MCP）的闪存和RAM |
| 文件页数： | 95/102页 |
| 文件大小： | 1606K |
| 代理商： | S71GL064A04BAI0B3 |
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92
S71GL032A Based MCPs
S71GL032A_00_A0 March 31, 2005
Advance
Info rmation
Functional Description
8M Version D
Note: X means don’t care (must be low or high state).
Absolute Maximum Ratings (4M Version F)
Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. Functional
operation should be restricted to recommended operating condition. Exposure to absolute maximum rating conditions for
extended periods may affect reliability.
Absolute Maximum Ratings (4M Version G, 8M Version C, 8M Version D)
Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. Functional
operation should be restricted to recommended operating condition. Exposure to absolute maximum rating conditions for
extended periods may affect reliability.
CS1# CS2 OE# WE#
LB#
UB#
IO0~8
IO9~16
Mode
Power
H
X
High-Z
Deselected
Standby
X
L
X
High-Z
Deselected
Standby
X
H
High-Z
Deselected
Standby
L
H
L
X
High-Z
Output Disabled
Active
L
H
X
L
High-Z
Output Disabled
Active
L
H
L
H
L
H
Dout
High-Z
Lower Byte Read
Active
L
H
L
H
L
High-Z
Dout
Upper Byte Read
Active
L
H
L
H
L
Dout
Word Read
Active
L
H
X
L
H
Din
High-Z
Lower Byte Write
Active
L
H
X
L
H
L
High-Z
Din
Upper Byte Write
Active
L
H
X
L
Din
Word Write
Active
Item
Symbol
Ratings
Unit
Voltage on any pin relative to VSS
VIN,VOUT
-0.2 to VCC+0.3V
V
Voltage on VCC supply relative to VSS
VCC
-0.2 to 4.0V
V
Power Dissipation
PD
1.0
W
Operating Temperature
TA
-40 to 85
°C
Item
Symbol
Ratings
Unit
Voltage on any pin relative to VSS
VIN,VOUT
-0.2 to VCC+0.3V (Max. 3.6V)
V
Voltage on VCC supply relative to VSS
VCC
-0.2 to 3.6V
V
Power Dissipation
PD
1.0
W
Operating Temperature
TA
-40 to 85
°C
相关PDF资料 |
PDF描述 |
|---|---|
| S71GL064A04BAI0F3 | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A04BAW0B3 | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A04BAW0F3 | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A04BFI0B2 | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A04BFI0B3 | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
相关代理商/技术参数 |
参数描述 |
|---|---|
| S71GL064A04BAI0F0 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A04BAI0F2 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A04BAI0F3 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A04BAW0B0 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A04BAW0B2 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
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