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| 型号： | SFPA8192Q1BO2TO-I-QT-223-STD |
| 厂商： | Swissbit NA Inc |
| 文件页数： | 19/76页 |
| 文件大小： | 0K |
| 描述： | FLASH SSD SMART UDMA 2.5" 8GB |
| 视频文件： | Swissbit Manufacturing Overview |
| RoHS指令信息： | Environment Protection Declaration |
| 标准包装： | 4 |
| 系列： | P-120 |
| 存储容量： | 8GB |
| 存储器类型： | FLASH |
| 其它名称： | 1052-1025 |
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Table 24: Ultra DMA Sender and Recipient IC Timing Requirements
Name
Comments
UDMA
Mode 0
(ns)
UDMA
Mode 1
(ns)
UDMA
Mode 2
(ns)
UDMA
Mode 3
(ns)
UDMA
Mode4
(ns)
Min Max Min Max Min Max Min Max Min Max
t DSIC
Recipient IC data setup time (from
data valid until STROBE edge)
14.7
9.7
6.8
6.8
4.8
(see note 2)
t DHIC
Recipient IC data hold time (from
STROBE edge until data may
4.8
4.8
4.8
4.8
4.8
become invalid) (see note 2)
t DVSIC
Sender IC data valid setup time
(from data valid until STROBE
72.9
50.9
33.9
22.6
9.5
edge) (see note 3)
t DVHIC
Sender IC data valid hold time
(from STROBE edge until data
9.0
9.0
9.0
9.0
9.0
may become invalid) (see note 3)
Notes:
1.
2.
3.
All timing measurement switching points(low to high and high to low) shall be taken at 1.5 V.
The correct data value shall be captured by the recipient given input data with a slew rate of 0.4 V/ns rising and
falling and the input STROBE with a slew rate of 0.4 V/ns rising and falling at t DSIC and t DHIC timing (as measured
through 1.5 V).
The parameters t DVSIC and t DVHIC shall be met for lumped capacitive loads of 15 and 40 pF at the IC where all
signals have the same capacitive load value. Noise that may couple onto the output signals from external
sources has not been included in these values.
Table 25: Ultra DMA AC Signal Requirements
Name
Comment
Min
Max
Notes
[V/ns]
[V/ns]
S RISE
S FALL
Rising Edge Slew Rate for any signal
Falling Edge Slew Rate for any signal
1.25
1.25
1
1
Note:
1.
The sender shall be tested while driving an 18 inch long, 80 conductor cable with PVC insulation material. The
signal under test shall be cut at a test point so that it has not trace, cable or recipient loading after the test
point. All other signals should remain connected through to the recipient. The test point may be located at any
po int between the sender’s series termination resistor and one half inch or less of conductor exiting the
connector. If the test point is on a cable conductor rather than the PCB, an adjacent ground conductor shall
also be cut within one half inch of the connector.
The test load and test points should then be soldered directly to the exposed source side connectors. The test
loads consist of a 15 pF or a 40 pF, 5%, 0.08 inch by 0.05 inch surface mount or smaller size capacitor from the
test point to ground. Slew rates shall be met for both capacitor values.
Measurements shall be taken at the test point using a <1 pF, >100 kOhm, 1 GHz or faster probe and a 500 MHz
or faster oscilloscope. The average rate shall be measured from 20% to 80% of the settled VOH level with data
transitions at least 120 ns apart. The settled VOH level shall be measured as the average output high level
under the defined testing conditions from 100 nsec after 80% of a rising edge until 20% of the subsequent
falling edge.
6.3.2.4.1 Initiating an Ultra DMA Data-In Burst
a) An Ultra DMA Data-In burst is initiated by following the steps lettered below. The timing diagram is
shown in Figure 3: Ultra DMA Data-In Burst Initiation Timing. The associated timing parameters are
specified in Table 22: Ultra DMA Data Burst Timing Requirements and are described in Table 23: Ultra
b) The following steps shall occur in the order they are listed unless otherwise specifically allowed:
c)
The host shall keep -DMACK in the negated state before an Ultra DMA burst is initiated.
d) The device shall assert DMARQ to initiate an Ultra DMA burst. After assertion of DMARQ the device
shall not negate DMARQ until after the first negation of DSTROBE.
e) Steps (c), (d), and (e) may occur in any order or at the same time. The host shall assert STOP.
f)
The host shall negate -HDMARDY.
g) The host shall negate -CS0, -CS1, DA2, DA1, and DA0. The host shall keep -CS0, -CS1, DA2, DA1, and
DA0 negated until after negating -DMACK at the end of the burst.
h) Steps (c), (d), and (e) shall have occurred at least t ACK before the host asserts -DMACK. The host shall
keep -DMACK asserted until the end of an Ultra DMA burst.
i)
The host shall release D[15:00] within t AZ after asserting -DMACK.
Swissbit AG
Industriestrasse 4
Swissbit reserves the right to change products or specifications without notice.
Revision: 1.00
CH-9552 Bronschhofen
Switzerland
www.swissbit.com
industrial@swissbit.com
P-120_data_sheet_PA-QxBO_Rev100.doc
Page 19 of 76
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SFPA8192Q1BO2TO-I-QT-243 | 制造商:Swissbit 功能描述: |
| SFPA8192Q1BO2TO-I-QT-243-STD | 制造商:SWISSBIT NA INC 功能描述:FLASH 制造商:SWISSBIT 功能描述:SSD PATA 8GB 2.5" IND P-120 制造商:SWISSBIT 功能描述:SSD, PATA, 8GB, 2.5", IND, P-120 |
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