参数资料
型号: SI7913DN-T1-GE3
厂商: Vishay Siliconix
文件页数: 1/12页
文件大小: 0K
描述: MOSFET P-CH 20V 1212-8 PPAK
标准包装: 1
系列: TrenchFET®
FET 型: 2 个 P 沟道(双)
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 20V
电流 - 连续漏极(Id) @ 25° C: 5A
开态Rds(最大)@ Id, Vgs @ 25° C: 37 毫欧 @ 7.4A,4.5V
Id 时的 Vgs(th)(最大): 1V @ 250µA
闸电荷(Qg) @ Vgs: 24nC @ 4.5V
功率 - 最大: 1.3W
安装类型: 表面贴装
封装/外壳: PowerPAK? 1212-8 双
供应商设备封装: PowerPAK? 1212-8 Dual
包装: 标准包装
其它名称: SI7913DN-T1-GE3DKR
Si7913DN
Vishay Siliconix
Dual P-Channel 20-V (D-S) MOSFET
PRODUCT SUMMARY
FEATURES
V DS (V)
- 20
R DS(on) ( Ω )
0.037 at V GS = - 4.5 V
0.048 at V GS = - 2.5 V
0.066 at V GS = - 1.8 V
I D (A)
- 7.4
- 6.5
- 55
? Halogen-free According to IEC 61249-2-21
Available
? TrenchFET ? Power MOSFET
? New Low Thermal Resistance PowerPAK ?
Package
APPLICATIONS
? Portable
PowerPAK 1212-8
- PA Switch
- Battery Switch
3.30 mm
1
S1
G1
3.30 mm
- Load Switch
S 1
S 2
2
3
S2
G2
8
D1
D1
4
G 1
G 2
7
D2
6
5
D2
Bottom View
Ordering Information: Si7913DN-T1-E3 (Lead (Pb)-free)
Si7913DN-T1-GE3 (Lead (Pb)-free and Halogen-free)
D 1
P-Channel MOSFET
D 2
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS T A = 25 °C, unless otherwise noted
Parameter
Drain-Source Voltage
Gate-Source Voltage
Symbol
V DS
V GS
10 s
Steady State
- 20
±8
Unit
V
Continuous Drain Current (T J = 150 °C) a
Pulsed Drain Current
T A = 25 °C
T A = 85 °C
I D
I DM
- 7.4
- 5.3
- 20
- 5.0
- 3.6
A
Continuous Source Current (Diode Conduction) a
I S
- 2.3
- 1.1
Maximum Power Dissipation a
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature) b, c
T A = 25 °C
T A = 85 °C
P D
T J , T stg
2.8
1.5
- 55 to 150
260
1.3
0.85
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Typical
Maximum
Unit
Maximum Junction-to-Ambient a
Maximum Junction-to-Case
t ≤ 10 s
Steady State
Steady State
R thJA
R thJC
35
75
4
44
94
5
°C/W
Notes:
a. Surface Mounted on 1" x 1" FR4 board.
b. See Solder Profile ( www.vishay.com/ppg?73257 ). The PowerPAK 1212-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and
is not required to ensure adequate bottom side solder interconnection.
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 72615
S-83050-Rev. C, 29-Dec-08
www.vishay.com
1
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