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| 型号： | SI8439DB-T1-E1 |
| 厂商： | Vishay Siliconix |
| 文件页数： | 10/11页 |
| 文件大小： | 0K |
| 描述： | MOSFET P-CH 8V D-S MICROFOOT |
| 标准包装： | 1 |
| 系列： | TrenchFET® |
| FET 型： | MOSFET P 通道，金属氧化物 |
| FET 特点： | 逻辑电平门 |
| 漏极至源极电压(Vdss)： | 8V |
| 电流 - 连续漏极(Id) @ 25° C： | 5.9A |
| 开态Rds（最大）@ Id, Vgs @ 25° C： | 25 毫欧 @ 1.5A，4.5V |
| Id 时的 Vgs(th)（最大）： | 800mV @ 250µA |
| 闸电荷(Qg) @ Vgs： | 50nC @ 4.5V |
| 功率 - 最大： | 1.1W |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 4-UFBGA |
| 供应商设备封装： | 4-Microfoot |
| 包装： | 标准包装 |
| 其它名称： | SI8439DB-T1-E1DKR |
AN824
Vishay Siliconix
Board pad design. The landing-pad size for MICRO FOOT
products is determined by the bump pitch as shown in Table 3.
The pad pattern is circular to ensure a symmetric,
barrel-shaped solder bump.
TABLE 3
Dimensions of Copper Pad and Solder Mask
Opening in PCB and Stencil Aperture
Solder Mask Stencil
Pitch Copper Pad Opening Aperture
Chip pick-and-placement. MICRO FOOT products can be
picked and placed with standard pick-and-place equipment.
The recommended pick-and-place force is 150 g. Though the
part will self-center during solder reflow, the maximum
placement offset is 0.02 mm.
Reflow Process . MICRO FOOT products can be assembled
using standard SMT reflow processes. Similar to any other
package, the thermal profile at specific board locations must
be determined. Nitrogen purge is recommended during reflow
operation. Figure 6 shows a typical reflow profile.
0.80 mm
0.50 mm
0.30 " 0.01 mm
0.17 " 0.01 mm
0.41 " 0.01 mm
0.27 " 0.01 mm
0.33 " 0.01 mm
in ciircle aperture
0.30 " 0.01 mm
in square aperture
250
Thermal Profile
200
ASSEMBLY PROCESS
MICRO FOOT products’ surface-mount-assembly operations
include solder paste printing, component placement, and
solder reflow as shown in the process flow chart (Figure 5).
150
100
50
Stencil Design
IIncoming Tape and Reel Inspection
0
Solder Paste Printing
0
100
200
Time (Seconds
300
400
Chip Placement
Reflow
Solder Joint Inspection
Pack and Ship
FIGURE 5. SMT Assembly Process Flow
FIGURE 6. Reflow Profile
PCB REWORK
To replace MICRO FOOT products on PCB, the rework
procedure is much like the rework process for a standard BGA
or CSP, as long as the rework process duplicates the original
reflow profile. The key steps are as follows:
Stencil design . Stencil design is the key to ensuring
maximum solder paste deposition without compromising the
assembly yield from solder joint defects (such as bridging and
extraneous solder spheres). The stencil aperture is dependent
on the copper pad size, the solder mask opening, and the
quantity of solder paste.
In MICRO FOOT products, the stencil is 0.125-mm (5-mils)
thick. The recommended apertures are shown in Table 3 and
are fabricated by laser cut.
Solder-paste printing. The solder-paste printing process
involves transferring solder paste through pre-defined
apertures via application of pressure.
In MICRO FOOT products, the solder paste used is UP78
No-clean eutectic 63 Sn/37Pb type3 or finer solder paste.
Document Number: 71990
06-Jan-03
1.
2.
3.
4.
5.
6.
Remove the MICRO FOOT device using a convection
nozzle to create localized heating similar to the original
reflow profile. Preheat from the bottom.
Once the nozzle temperature is +190 _ C, use tweezers to
remove the part to be replaced.
Resurface the pads using a temperature-controlled
soldering iron.
Apply gel flux to the pad.
Use a vacuum needle pick-up tip to pick up the
replacement part, and use a placement jig to placed it
accurately.
Reflow the part using the same convection nozzle, and
preheat from the bottom, matching the original reflow
profile.
www.vishay.com
3
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