参数资料
型号: SOUNDBITE
厂商: Freescale Semiconductor
文件页数: 35/68页
文件大小: 0K
描述: BOARD DEMO AUDIO DEVELOPMENT
标准包装: 1
系列: Symphony™ soundBite
主要目的: 音频,音频处理
已用 IC / 零件: DSPB56371
主要属性: 最高 8 通道数字音频
次要属性: USB、I2C、SPI 接口
已供物品: 板,缆线,CD
Thermal Characteristics
6
Thermal Characteristics
Table 15. Thermal Characteristics
Characteristic
Natural Convection, Junction-to-ambient thermal
resistance 1,2
Junction-to-case thermal resistance 3
Symbol
R θ JA or θ JA
R θ JC or θ JC
TQFP Value
39
18.25
Unit
° C/W
° C/W
Note:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
3. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1).
7
DC Electrical Characteristics
Table 16. DC ELECTRICAL CHARACTERISTICS 4
Characteristics
Supply voltages
Symbol
V DD
Min
1.2
Typ
1.25
Max
1.3 1
Unit
V
? Core (core_vdd)
? PLL (plld_vdd)
Supply voltages
V DDIO
3.14
3.3
3.46 1
V
? Vio_vdd
? PLL (pllp_vdd)
? PLL (plla_vdd)
Input high voltage
V
? All pins
V IH
2.0
V IO_VDD+2V
Note: All 3.3 V supplies must rise prior to the rise of the 1.25 V supplies to avoid a high current condition and
possible system damage.
Input low voltage
? All pins
Input leakage current (All pins)
Clock pin Input Capacitance (EXTAL)
High impedance (off-state) input current
V IL
I IN
C IN
I TSI
–0.3
–84
3.749
0.8
84
84
V
μ A
pF
μ A
(@ 3.46 V)
Output high voltage
V OH
2.4
V
I OH = -5 mA
Output low voltage
V OL
0.4
V
I OL = 5 mA
Internal supply current 1 at internal clock of
181MHz
? In Normal mode
I CCI
99
200
mA
DSP56371 Data Sheet, Rev. 4.1
Freescale Semiconductor
35
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