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参数资料
| 型号： | SPC5632MF0MLQA4 |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | FLASH, 40 MHz, MICROCONTROLLER, PQFP144 |
| 封装： | 20 X 20 MM, 0.50 MM PITCH, 1.40 HEIGHT, ROHS COMPLIANT, LQFP-144 |
| 文件页数： | 81/122页 |
| 文件大小： | 1173K |
| 代理商： | SPC5632MF0MLQA4 |
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Electrical characteristics
MPC5634M Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
61
Table 10. Thermal characteristics for 176-pin LQFP1
1 Thermal characteristics are targets based on simulation that are subject to change per device characterization.
Symbol
C
Parameter
Conditions
Value
Unit
RθJA
CC
D Junction-to-Ambient, Natural Convection2
2 Junction-to-Ambient Thermal Resistance determined per JEDEC JESD51-3 and JESD51-6. Thermal test board
meets JEDEC specification for this package.
Single layer board - 1s
38
°C/W
RθJA
CC
D Junction-to-Ambient, Natural Convection2
Four layer board - 2s2p
31
°C/W
RθJMA
CC
D Junction-to-Moving-Air, Ambient2
@200 ft./min., single layer
board - 1s
30
°C/W
RθJMA
CC
D Junction-to-Moving-Air, Ambient2
@200 ft./min., four layer
board - 2s2p
25
°C/W
RθJB
CC
D Junction-to-Board3
3 Junction-to-Board thermal resistance determined per JEDEC JESD51-8. Thermal test board meets JEDEC
specification for the specified package.
20
°C/W
RθJCtop
CC
D Junction-to-Case4
4 Junction-to-Case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate
temperature is used for the case temperature. Reported value includes the thermal resistance of the interface layer.
5
°C/W
Ψ
JT
CC
D Junction-to-Package Top, Natural
Convection5
5 Thermal characterization parameter indicating the temperature difference between the package top and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization
parameter is written as Psi-JT.
2
°C/W
Table 11. Thermal characteristics for 208-pin MAPBGA1
1 Thermal characteristics are targets based on simulation that are subject to change per device characterization.
Symbol
C
Parameter
Conditions
Value
Unit
RθJA
CC
D
Junction-to-ambient, natural convection2,3
2 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board
thermal resistance.
3 Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
One layer board - 1s
39
°C/W
RθJMA
CC
D
Junction-to-ambient natural convection2,4
4 Per JEDEC JESD51-6 with the board horizontal.
Four layer board - 2s2p
24
°C/W
RθJA
CC
D
Junction-to-ambient (@200 ft/min)2,4
Single layer board
31
°C/W
RθJMA
CC
D
Junction-to-ambient (@200 ft/min)2,4
Four layer board 2s2p
20
°C/W
RθJB
CC
D
Junction-to-board5
5
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
Four layer board - 2s2p
13
°C/W
RθJC
CC
D
Junction-to-case6
6 Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate
method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.
6
°C/W
Ψ
JT
CC
D
Junction-to-package top natural
convection7
2
°C/W
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相关代理商/技术参数 |
参数描述 |
|---|---|
| SPC5632MF0MLQA6 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:microcontroller units (MCUs) |
| SPC5632MF0MLQA8 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:microcontroller units (MCUs) |
| SPC5632MF0MLUA4 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:microcontroller units (MCUs) |
| SPC5632MF0MLUA6 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:microcontroller units (MCUs) |
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