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参数资料
| 型号： | SPC5632MF0MLQA4 |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | FLASH, 40 MHz, MICROCONTROLLER, PQFP144 |
| 封装： | 20 X 20 MM, 0.50 MM PITCH, 1.40 HEIGHT, ROHS COMPLIANT, LQFP-144 |
| 文件页数： | 83/122页 |
| 文件大小： | 1173K |
| 代理商： | SPC5632MF0MLQA4 |
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Electrical characteristics
MPC5634M Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
63
The thermal resistance is expressed as the sum of a junction-to-case thermal resistance plus a case-to-ambient thermal
resistance:
RθJA = RθJC + RθCA
Eqn. 3
where:
RθJA = junction-to-ambient thermal resistance (
oC/W)
RθJC = junction-to-case thermal resistance (
oC/W)
RθCA = case to ambient thermal resistance (
oC/W)
RθJC s device related and is not affected by other factors. The thermal environment can be controlled to change the
case-to-ambient thermal resistance, RθCA. For example, change the air flow around the device, add a heat sink, change the
mounting arrangement on the printed circuit board, or change the thermal dissipation on the printed circuit board surrounding
the device. This description is most useful for packages with heat sinks where 90% of the heat flow is through the case to heat
sink to ambient. For most packages, a better model is required.
A more accurate two-resistor thermal model can be constructed from the junction-to-board thermal resistance and the
junction-to-case thermal resistance. The junction-to-case thermal resistance describes when using a heat sink or where a
substantial amount of heat is dissipated from the top of the package. The junction-to-board thermal resistance describes the
thermal performance when most of the heat is conducted to the printed circuit board. This model can be used to generate simple
estimations and for computational fluid dynamics (CFD) thermal models.
To determine the junction temperature of the device in the application on a prototype board, use the thermal characterization
parameter (
Ψ
JT) to determine the junction temperature by measuring the temperature at the top center of the package case using
the following equation:
TJ = TT + (ΨJT x PD)
Eqn. 4
where:
TT
= thermocouple temperature on top of the package (oC)
Ψ
JT
= thermal characterization parameter (oC/W)
PD
= power dissipation in the package (W)
The thermal characterization parameter is measured in compliance with the JESD51-2 specification using a 40-gauge type T
thermocouple epoxied to the top center of the package case. Position the thermocouple so that the thermocouple junction rests
on the package. Place a small amount of epoxy on the thermocouple junction and approximately 1 mm of wire extending from
the junction. Place the thermocouple wire flat against the package case to avoid measurement errors caused by the cooling
effects of the thermocouple wire.
References:
Semiconductor Equipment and Materials International
3081 Zanker Road
San Jose, CA 95134
USA
(408) 943-6900
MIL-SPEC and EIA/JESD (JEDEC) specifications are available from Global Engineering Documents at 800-854-7179 or
303-397-7956.
JEDEC specifications are available on the web at http://www.jedec.org.
C.E. Triplett and B. Joiner, “An Experimental Characterization of a 272 PBGA Within an Automotive Engine
Controller Module,” Proceedings of SemiTherm, San Diego, 1998, pp. 47-54.
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相关代理商/技术参数 |
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| SPC5632MF0MLQA6 | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:microcontroller units (MCUs) |
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