参数资料
型号: ST72T774S9T1
厂商: STMICROELECTRONICS
元件分类: 微控制器/微处理器
英文描述: 8-BIT, OTPROM, 8 MHz, MICROCONTROLLER, PQFP44
封装: TQFP-44
文件页数: 39/144页
文件大小: 1280K
代理商: ST72T774S9T1
ST72774/ST727754/ST72734
133/144
6.1 POWER CONSIDERATIONS
The average chip-junction temperature, TJ, in
degrees Celsius, may be calculated using the
following equation:
TJ = TA + (PD x θJA) (1)
Where:
– TA is the Ambient Temperature in °C,
θJ
A is the Package Junction-to-Ambient Thermal
Resistance, in
°C/W,
– PD is the sum of PINT and PI/O,
– PINT is the product of IDD and VDD, expressed in
Watts. This is the Chip Internal Power
– PI/O represents the Power Dissipation on Input
and Output Pins; User Determined.
For most applications PI/O<PINT and may be
neglected. PI/O may be significant if the device is
configured to drive Darlington bases or sink LED
Loads.
An approximate relationship between PD and TJ
(if PI/O is neglected) is given by:
PD = K÷ (TJ + 273°C) (2)
Therefore:
K = PD x (TA + 273°C) + θJA x PD
2 (3)
Where:
– K is a constant for the particular part, which may
be determined from equation (3) by measuring
PD (at equilibrium) for a known TA. Using this
value of K, the values of PD and TJ may be ob-
tained by solving equations (1) and (2) iteratively
for any value of TA.
Table 34. Thermal Characteristics
Symbol
Package
Value
Unit
θJ
A
PSDIP42
95
°C/W
θJ
A
TQFP44
95
°C/W
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