- 您现在的位置：买卖IC网 > PDF目录69397 > STPCC0175BTI3 (STMICROELECTRONICS) 32-BIT, 75 MHz, MICROPROCESSOR, PBGA388 PDF资料下载
参数资料
| 型号： | STPCC0175BTI3 |
| 厂商： | STMICROELECTRONICS |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 75 MHz, MICROPROCESSOR, PBGA388 |
| 封装： | PLASTIC, BGA-388 |
| 文件页数： | 33/47页 |
| 文件大小： | 747K |
| 代理商： | STPCC0175BTI3 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页当前第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页
BOARD LAYOUT
39/47
Issue 1.6
6. BOARD LAYOUT
6.1 THERMAL DISSIPATION
Thermal dissipation of the STPC depends mainly
on supply voltage. As a result, when the system
does not need to work at 3.3V, it may be to reduce
the voltage to 3.15V for example. This may save
few 100’s of mW.
The second area that can be concidered is un-
used interfaces and functions. Depending on the
application, some input signals can be grounded,
and some blocks not powered or shutdown. Clock
speed dynamic adjustment is also a solution that
can be used along with the integrated power man-
agement unit.
The standard way to route thermal balls to internal
ground layer implements only one via pad for each
ball pad, connected using a 8-mil wire.
With such configuration the Plastic BGA 388 pack-
age dissipates 90% of the heat through the ground
balls, and especially the central thermal balls
which are directly connected to the die, the re-
maining 10% is dissipated through the case. Add-
ing a heat sink reduces this value to 85%.
As a result, some basic rules have to be applied
when routing the STPC in order to avoid thermal
problems.
First of all, the whole ground layer acts as a heat
sink and ground balls must be directly connected
to it as illustrated in Figure 6-1.
If one ground layer is not enough, a second
ground plane may be added on the solder side.
Figure 6-1. Ground routing
Pad for ground ball
Thru hole to ground layer
TopL
ayer : S
ignals
Groundl
ayer
Powerla
yer
Bottom
Layer:
signals
+ local g
roundla
yer (ifn
eeded)
Note: For better visibility, ground balls are not all routed.
相关PDF资料 |
PDF描述 |
|---|---|
| STPCE1EEBC | MULTIFUNCTION PERIPHERAL, PBGA388 |
| STR631FV0T6 | 32-BIT, FLASH, 36 MHz, RISC MICROCONTROLLER, PQFP100 |
| STR636FV2T6 | 32-BIT, FLASH, 36 MHz, RISC MICROCONTROLLER, PQFP100 |
| STR630FZ2H6 | 32-BIT, FLASH, 36 MHz, RISC MICROCONTROLLER, PBGA144 |
| STR630FZ2T6 | 32-BIT, FLASH, 36 MHz, RISC MICROCONTROLLER, PQFP144 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| STPCC0180BTC3 | 功能描述:微处理器 - MPU 80MHz x86 Embedded RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| STPCC0180BTI3 | 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:PC Compatible Embeded Microprocessor |
| STPCC03 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:STPC CONSUMER-S DATASHEET/ PC COMPATIBLE EMBEDDED MICROPROCESSOR |
| STPCC0310BTC3 | 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:PC Compatible Embeded Microprocessor |
| STPCC0366BTC3 | 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:PC Compatible Embeded Microprocessor |
发布紧急采购，3分钟左右您将得到回复。