参数资料
型号: TDA8757AHL/21
厂商: NXP SEMICONDUCTORS
元件分类: ADC
英文描述: 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP144
封装: PLASTIC, HLQFP-144
文件页数: 26/37页
文件大小: 908K
代理商: TDA8757AHL/21
Philips Semiconductors
TDA8757A
Triple 8-bit ADC 205 Msps
Preliminary data
Rev. 01 — 22 March 2002
32 of 37
9397 750 09549
Koninklijke Philips Electronics N.V. 2002. All rights reserved.
14. Package outline
Fig 19. Package outline.
UNIT
A1
A2
A3
bp
ce
HE
HD
LLp
ZE
(1)
ZD
(1)
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.15
0.05
1.45
1.35
0.25
0.27
0.17
0.20
0.09
20.1
19.9
0.5
22.15
21.85
1.4
1.1
7
0
o
0.08
0.2
0.08
1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT612-1
MS-026
00-03-22
02-01-25
D(1)
E(1)
20.1
19.9
Dh
7.1
6.9
Eh
7.1
6.9
22.15
21.85
1.4
1.1
0
5
10 mm
scale
bp
e
θ
E
A1
A
L p
detail X
L
(A )
3
B
c
b p
E
H
A2
D
H
v M B
D
Z D
A
Z E
e
v M A
X
y
w M
A
max.
1.6
HLQFP144: plastic thermal enhanced low profile quad flat package; 144 leads;
body 20 x 20 x 1.4 mm; exposed die pad
SOT612-1
108
109
pin 1 index
Eh
Dh
73
72
37
1
144
36
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