- 您现在的位置：买卖IC网 > PDF目录98202 > TDA8757AHL/21 (NXP SEMICONDUCTORS) 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP144 PDF资料下载
参数资料
| 型号： | TDA8757AHL/21 |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | ADC |
| 英文描述： | 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP144 |
| 封装： | PLASTIC, HLQFP-144 |
| 文件页数： | 28/37页 |
| 文件大小： | 908K |
| 代理商： | TDA8757AHL/21 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页当前第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页
Philips Semiconductors
TDA8757A
Triple 8-bit ADC 205 Msps
Preliminary data
Rev. 01 — 22 March 2002
34 of 37
9397 750 09549
Koninklijke Philips Electronics N.V. 2002. All rights reserved.
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45° angle
to the transport direction of the printed-circuit board. The footprint must
incorporate solder thieves downstream and at the side corners.
During placement and before soldering, the package must be xed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time is 4 seconds at 250
°C. A mildly-activated ux will eliminate the
need for removal of corrosive residues in most applications.
16.4 Manual soldering
Fix the component by rst soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the at part of the lead. Contact time
must be limited to 10 seconds at up to 300
°C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320
°C.
16.5 Package related soldering information
[1]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the
Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods.
[2]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
[3]
If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[4]
Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger
than 0.8 mm; it is denitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[5]
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is denitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Table 19: Suitability of surface mount IC packages for wave and reow soldering
methods
Package
Soldering method
Wave
Reow[1]
BGA, HBGA, LFBGA, SQFP, TFBGA
not suitable
suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, SMS
not suitable[2]
suitable
PLCC[3], SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended[3][4]
suitable
SSOP, TSSOP, VSO
not recommended[5]
suitable
相关PDF资料 |
PDF描述 |
|---|---|
| TDA8757CHV/21 | 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP144 |
| TDA8757CHV/17 | 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP144 |
| TDA8758GPB | 2-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP48 |
| TDA8758GP | 2-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP48 |
| TDA8760K/4A | 1-CH 10-BIT DELTA-SIGMA ADC, PARALLEL ACCESS, PQCC44 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| TDA8757HL | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Triple 8-bit ADC 170 Msps |
| TDA8758 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:YC 8-bit low-power analog-to-digital video interface |
| TDA8758G | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:YC 8-bit low-power analog-to-digital video interface |
| TDA8759HV/8/C1 | 功能描述:模数转换器 - ADC 3X8-BITS VIDEO ADC 110MSPS RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32 |
| TDA8759HV/8/C1,551 | 功能描述:模数转换器 - ADC 3X8-BITS VIDEO RoHS:否 制造商:Texas Instruments 通道数量:2 结构:Sigma-Delta 转换速率:125 SPs to 8 KSPs 分辨率:24 bit 输入类型:Differential 信噪比:107 dB 接口类型:SPI 工作电源电压:1.7 V to 3.6 V, 2.7 V to 5.25 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-32 |
发布紧急采购，3分钟左右您将得到回复。