参数资料
型号: TDA8757AHL/21
厂商: NXP SEMICONDUCTORS
元件分类: ADC
英文描述: 3-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PQFP144
封装: PLASTIC, HLQFP-144
文件页数: 31/37页
文件大小: 908K
代理商: TDA8757AHL/21
Koninklijke Philips Electronics N.V. 2002.
Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 22 March 2002
Document order number: 9397 750 09549
Contents
Philips Semiconductors
TDA8757A
Triple 8-bit ADC 205 Msps
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pinning information . . . . . . . . . . . . . . . . . . . . . . 7
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 7
Functional description . . . . . . . . . . . . . . . . . . 11
Analog video inputs . . . . . . . . . . . . . . . . . . . . 11
Clamps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Variable gain amplifiers . . . . . . . . . . . . . . . . . 13
Important recommendations . . . . . . . . . . . . . . 13
ADCs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Data outputs . . . . . . . . . . . . . . . . . . . . . . . . . . 14
PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
9I2C-bus and 3W-bus interfaces . . . . . . . . . . . . 17
Register definitions . . . . . . . . . . . . . . . . . . . . . 17
Subaddress. . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Offset register . . . . . . . . . . . . . . . . . . . . . . . . . 17
Coarse and Fine registers . . . . . . . . . . . . . . . 18
Control register . . . . . . . . . . . . . . . . . . . . . . . . 19
VCO register . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Divider register . . . . . . . . . . . . . . . . . . . . . . . . 20
Phase register. . . . . . . . . . . . . . . . . . . . . . . . . 20
DEMUX register . . . . . . . . . . . . . . . . . . . . . . . 21
Power-down mode . . . . . . . . . . . . . . . . . . . . . 21
I2C-bus protocol . . . . . . . . . . . . . . . . . . . . . . . 21
3W-bus protocol . . . . . . . . . . . . . . . . . . . . . . . 22
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 22
Thermal characteristics. . . . . . . . . . . . . . . . . . 23
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 23
Application information. . . . . . . . . . . . . . . . . . 31
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 32
Handling information. . . . . . . . . . . . . . . . . . . . 33
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 33
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 33
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 34
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 35
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 36
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
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