参数资料
型号: TSPC603PMAB/C8ME
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 200 MHz, RISC PROCESSOR, CQFP240
封装: CERQUAD-240
文件页数: 29/38页
文件大小: 704K
代理商: TSPC603PMAB/C8ME
TSPC603p
35/38
8. PACKAGE MECHANICAL DATA
8.1. 240 pins - CQFP
Notes :
1. Dimensioning and tolerancing per
ASME Y14.5M–1994
2. Controlling dimension : millimeter.
3. Datum plane H is located at bottom of
lead and is coincident with the lead
where the lead exits the ceramic body at
the bottom of the parting line.
4. Datum L. M and N to be determined
at datum plane H.
5. Dimension S and V to be determined
at seating plane T.
6. Dimension A and B define maximum
ceramic body dimensions including
glass protrusion and top and bottom
mismatch.
MILLIMETERS
DIM
MIN
TYP
MAX
A
30.86
31.00
31.75
B
30.86
31.00
31.75
C
3.67
3.95
4.15
D
0.185
0.220
0.270
E
3.10
3.50
3.90
F
0.175
0.200
0.225
G
0.50 BSC
HE
2.025
2.100
2.175
J
0.130
0.147
0.175
K
0.45
0.50
0.55
P
0.25 BSC
S
34.41
34.58
34.75
U
17.20
17.30
17.40
V
34.41
34.58
34.75
W
0.25
0.50
0.75
Y
17.20
17.30
17.40
Z
0.122
0.127
0.132
AA
1.80 REF
AB
0.95 REF
q21°
4
°
7
°
Figure 17 : Mechanical dimensions of the Wire-bond CQFP package
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