参数资料
型号: TSPC603PMAB/C8ME
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 200 MHz, RISC PROCESSOR, CQFP240
封装: CERQUAD-240
文件页数: 30/38页
文件大小: 704K
代理商: TSPC603PMAB/C8ME
TSPC603p
36/38
8.2. BGA package description
The following sections provide the package parameters and mechanical dimensions for the CBGA packages.
8.2.1.Package parameters
The package parameters are as provided in the following list. The package type is 21 mm, 255-lead ceramic ball grid array (CBGA).
Package outline
21 mm
. . . . . . . . . . .
Interconnects
255
. . . . . . . . . . . . .
Pitch
1.27 mm
. . . . . . . . . . . . . . . . . . . . .
maximum module height
3.16 mm
. . .
8.2.2.Mechanical dimensions of the BGA package
Figure 18 provides the mechanical dimensions and bottom surface nomenclature of the CBGA package.
A
B
C
D
G
H
K
N
P
DIM
MIN
MAX
MIN
MILLIMETERS
INCHES
21.000 BSC
0.827 BSC
2.300
3.160
0.081
0.124
0.820
0.830
0.032
0.036
5.000 16.000
0.197
0.630
0.197
16.000
5.000
0.039
0.031
0.990
0.790
1.270 BSC
0.050 BSC
0.635 BSC
0.025 BSC
NOTES :
1. DIMENSIONING AND TOLERANCING
PER ASME Y14.5M 1994
2. CONTROLLING DIMENSION :
MILLIMETER
Figure 18 : Mechanical dimensions and bottom surface nomenclature of the CBGA package
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