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参数资料
| 型号： | TSPC603PMAB/C8ME |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 200 MHz, RISC PROCESSOR, CQFP240 |
| 封装： | CERQUAD-240 |
| 文件页数： | 4/38页 |
| 文件大小： | 704K |
| 代理商： | TSPC603PMAB/C8ME |
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TSPC603p
12/38
3.4. Thermal characterisrics
3.4.1.CQFP240 package
This section provides thermal management data for the 603p ; this information is based on a typical desktop configuration using a 240
lead, 32 mm x 32 mm, wire-bond CQFP package. The heat sink used for this data is a pinfin configuration from Thermalloy, part
number 2338.
3.4.1.1. Thermal characteristics
The thermal characteristics for a wire-bond CQFP package are as follows :
Thermal resistance (junction-to-case) = Rqjc or qjc = 2.2°C/Watt.
3.4.1.2. Thermal management example
The following example is based on a typical desktop configuration using a wire-bond CQFP package. The heat sink used for this data
is a pinfin heat sink #2338 attached to the wire-bond CQFP package with thermal grease.
Figure 5 provides a thermal management example for the CQFP package.
0
5
10
15
20
25
30
35
012
345
Junction-to-Ambient
thermal
Resistance
(degreeC/Watt)
Forced convection (m/sec)
Motorola Wire-Bond CQFP
With Heat Sink
Figure 5 : CQFP thermal management exemple
The junction temperature can be calculated from the junction to ambient thermal resistance, as follows :
Junction temperature :
Tj = Ta + Rqja * P
or
Tj = Ta + (Rqjc + Rcs + Rsa) * P
Where :
Ta is the ambient temperature in the vicinity of the device
Rqja is the junction-to-ambient thermal resistance
Rqjc is the junction-to-case thermal resistance of the device
Rcs is the case-to-heat sink thermal resistance of the interface material
Rsa is the heat sink-to-ambient thermal resistance
P is the power dissipated by the device
In this environment, it can be assumed that all the heat is dissipated to the ambient through the heat sink, so the junction-to-ambient
thermal resistance is the sum of the resistances from the junction to the case, from the case to the heat sink, and from the heat sink to
the ambient.
Note that verification of external thermal resistance and case temperature should be performed for each application. Thermal resis-
tance can vary considerably due to many factors including degree of air turbulence.
For a power dissipation of 2.5 Watts in an ambient temperature of 40
°C at 1 m/sec with the heat sink measured above, the junction
temperature of the device would be as follows :
Tj = Ta + Rqja * P
Tj = 40°C + (10°C/Watt * 2.5 watts) = 65°C
which is well within the reliability limits of the device.
Notes :
1. Junction-to-ambient thermal resistance is based on measurements on single-sided printed circuit boards per SEMI (Semiconductor Equip-
ment and Materials International) G38-87 in natural convection.
2. Junction-to-case thermal resistance is based on measurements using a cold plate per SEMI G30-88 with the exception that the cold plate
temperature is used for the case temperature.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| TSPC603R | 制造商:ATMEL 制造商全称:ATMEL Corporation 功能描述:PowerPC 603e RISC Microprocessor Family PID7t-603e |
| TSPC603RCAB/Q8L | 制造商:ATMEL 制造商全称:ATMEL Corporation 功能描述:PowerPC 603e RISC Microprocessor Family PID7t-603e |
| TSPC603RCAB/Q8LC | 制造商:ATMEL 制造商全称:ATMEL Corporation 功能描述:PowerPC 603e RISC Microprocessor Family PID7t-603e |
| TSPC603RMAB/Q8L | 制造商:ATMEL 制造商全称:ATMEL Corporation 功能描述:PowerPC 603e RISC Microprocessor Family PID7t-603e |
| TSPC603RMAB/Q8LC | 制造商:ATMEL 制造商全称:ATMEL Corporation 功能描述:PowerPC 603e RISC Microprocessor Family PID7t-603e |
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