参数资料
型号: V58C2256404SHUR5
厂商: PROMOS TECHNOLOGIES INC
元件分类: DRAM
英文描述: 64M X 4 DDR DRAM, PBGA60
封装: ROHS COMPLIANT, MO-233, FBGA-60
文件页数: 18/60页
文件大小: 1125K
代理商: V58C2256404SHUR5
25
ProMOS TECHNOLOGIES
V58C2256(804/404/164)SH
V58C2256(804/404/164)SH Rev. 1.1 July 2010
Write Interrupted by a Read
A Burst Write can be interrupted by a Read command to any bank. If a burst write operation is interrupted
prior to the end of the burst operation, then the last two pieces of input data prior to the Read command must
be masked off with the data mask (DM) input pin to prevent invalid data from being written into the memory
array. Any data that is present on the DQ pins coincident with or following the Read command will be masked
off by the Read command and will not be written to the array. The memory controller must give up control of
both the DQ bus and the DQS bus at least one clock cycle before the read data appears on the outputs in
order to avoid contention. In order to avoid data contention within the device, a delay is required (tWTR) from
the first positive CK edge after the last desired data in the pair tWTR before a Read command can be issued
to the device. It is illegal to interrupt a Write with autoprecharge command with a Read command.
Write Interrupted by a Read Command Timing
Auto Refresh
The Auto Refresh command is issued by having CS, RAS, and CAS held low with CKE and WE high at the
rising edge of the clock. All banks must be precharged and idle for a tRP(min) before the Auto Refresh com-
mand is applied. No control of the address pins is required once this cycle has started because of the internal
address counter. When the Auto Refresh cycle has completed, all banks will be in the idle state. A delay be-
tween the Auto Refresh command and the next Activate command or subsequent Auto Refresh command
must be greater than or equal to the tRFC(min). Commands may not be issued to the device once an Auto
Refresh cycle has begun. CS input must remain high during the refresh period or NOP commands must be
registered on each rising edge of the CK input until the refresh period is satisfied.
Auto Refresh Timing
(CAS Latency = 2; Burst Length = 8)
T0
T1
T2
T3
T4
T5
T6
T7
T8
T9
T10
T11
Write
NOP
Read
NOP
CK, CK
Command
DQS
T12
DM
D2 D3 D4 D5
D0
D2 D3 D4 D5 D6
D1
D7
DQ
Data is masked
by Read command
Data is masked
by DM input
DQS input ignored
D0 D1
tWTR
T0
T1
T2
T3
T4
T5
T6
T7
T8
T9
T10
NOP
CK, CK
Command
CKE
T11
Auto Ref
ANY
High
Pre All
tRFC
tRP
相关PDF资料
PDF描述
V58C2256804SHLI4I 32M X 8 DDR DRAM, PDSO66
V58C2256804SHLJ6E 32M X 8 DDR DRAM, PBGA60
V58C2256804SHLS6I 32M X 8 DDR DRAM, PBGA60
V58C2256804SHLT6E 32M X 8 DDR DRAM, PDSO66
V58C2256804SHUD6E 32M X 8 DDR DRAM, PDSO66
相关代理商/技术参数
参数描述
V58C2256804S 制造商:MOSEL 制造商全称:MOSEL 功能描述:HIGH PERFORMANCE 2.5 VOLT 256 Mbit DDR SDRAM
V58C2256804SAT-5 制造商:Mosel Vitelic Corporation 功能描述:SDRAM, DDR, 32M x 8, 66 Pin, Plastic, TSSOP
V58C265164S 制造商:MOSEL 制造商全称:MOSEL 功能描述:64 Mbit DDR SDRAM 2.5 VOLT 4M X 16
V58C265404S 制造商:MOSEL 制造商全称:MOSEL 功能描述:HIGH PERFORMANCE 2.5 VOLT 16M X 4 DDR SDRAM 4 BANKS X 4Mbit X 4
V58C265804S 制造商:MOSEL 制造商全称:MOSEL 功能描述:HIGH PERFORMANCE 2.5 VOLT 8M X 8 DDR SDRAM 4 BANKS X 2Mbit X 8