参数资料
型号: W25Q32BWSNIP
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 4M X 8 SPI BUS SERIAL EEPROM, DSO8
封装: 0.150 INCH, GREEN, PLASTIC, SOIC-8
文件页数: 43/72页
文件大小: 2212K
代理商: W25Q32BWSNIP
W25Q32BW
When used to release the device from the power-down state and obtain the Device ID, the instruction is
the same as previously described, and shown in figure 28b, except that after /CS is driven high it must
remain high for a time duration of tRES2 (See AC Characteristics). After this time duration the device will
resume normal operation and other instructions will be accepted. If the Release from Power-down /
Device ID instruction is issued while an Erase, Program or Write cycle is in process (when BUSY equals
1) the instruction is ignored and will not have any effects on the current cycle.
Figure 28a. Release Power-down/High Performance Mode Instruction Sequence
Figure 28b. Release Power-down / Device ID Instruction Sequence Diagram
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