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参数资料
| 型号： | W25Q32BWSNIP |
| 厂商： | WINBOND ELECTRONICS CORP |
| 元件分类： | PROM |
| 英文描述： | 4M X 8 SPI BUS SERIAL EEPROM, DSO8 |
| 封装： | 0.150 INCH, GREEN, PLASTIC, SOIC-8 |
| 文件页数： | 47/72页 |
| 文件大小： | 2212K |
| 代理商： | W25Q32BWSNIP |
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W25Q32BW
Publication Release Date: July 08, 2010
- 51 -
Preliminary - Revision E
10.2.33 Read Manufacturer / Device ID Quad I/O (94h)
The Read Manufacturer / Device ID Quad I/O instruction is an alternative to the Read Manufacturer /
Device ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device ID
at 4x speed.
The Read Manufacturer / Device ID Quad I/O instruction is similar to the Fast Read Quad I/O instruction.
The instruction is initiated by driving the /CS pin low and shifting the instruction code “94h” followed by a
24-bit address (A23-A0) of 000000h, 8-bit Continuous Read Mode Bits and then four clock dummy
cycles, with the capability to input the Address bits four bits per clock. After which, the Manufacturer ID for
Winbond (EFh) and the Device ID are shifted out four bits per clock on the falling edge of CLK with most
significant bit (MSB) first as shown in figure 31. The Device ID values for the W25Q32BW is listed in
Manufacturer and Device Identification table. If the 24-bit address is initially set to 000001h the Device ID
will be read first and then followed by the Manufacturer ID. The Manufacturer and Device IDs can be read
continuously, alternating from one to the other. The instruction is completed by driving /CS high.
Figure 31. Read Manufacturer / Device ID Quad I/O Diagram
Note:
The “Continuous Read Mode” bits M(7-0) must be set to Fxh to be compatible with Fast Read Quad I/O instruction.
相关PDF资料 |
PDF描述 |
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| W25Q32BWSSIG | 4M X 8 SPI BUS SERIAL EEPROM, PDSO8 |
| W25Q40BWSNIP | 4M X 1 SPI BUS SERIAL EEPROM, PDSO8 |
| W25Q64BVSSIP | 8M X 8 SPI BUS SERIAL EEPROM, PDSO8 |
| W25Q64CVZPAG | 64M X 1 SPI BUS SERIAL EEPROM, PDSO8 |
| W25Q64CVZEAG | 64M X 1 SPI BUS SERIAL EEPROM, PDSO8 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| W25Q32DW | 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI |
| W25Q32DWSFIG | 功能描述:IC FLASH SPI 32MBIT 16SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:2,500 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:1K (128 x 8) 速度:100kHz 接口:UNI/O?（单线） 电源电压:1.8 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-TSSOP，8-MSOP（0.118"，3.00mm 宽） 供应商设备封装:8-MSOP 包装:带卷 (TR) |
| W25Q32DWSFIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI |
| W25Q32DWSSIG | 功能描述:IC FLASH SPI 32MBIT 8SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:2,500 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:1K (128 x 8) 速度:100kHz 接口:UNI/O?（单线） 电源电压:1.8 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-TSSOP，8-MSOP（0.118"，3.00mm 宽） 供应商设备封装:8-MSOP 包装:带卷 (TR) |
| W25Q32DWSSIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI |
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