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参数资料
| 型号： | W25Q32BWSNIP |
| 厂商： | WINBOND ELECTRONICS CORP |
| 元件分类： | PROM |
| 英文描述： | 4M X 8 SPI BUS SERIAL EEPROM, DSO8 |
| 封装： | 0.150 INCH, GREEN, PLASTIC, SOIC-8 |
| 文件页数： | 70/72页 |
| 文件大小： | 2212K |
| 代理商： | W25Q32BWSNIP |
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W25Q32BW
- 72 -
14. REVISION HISTORY
VERSION
DATE
PAGE
DESCRIPTION
A
08/24/08
New Create Preliminary
B
03/13/09
19, 31, 33, 36,
69 & 70
20, 54~56
69
32,33
14
Added Set Burst with Wrap Opcode 77h
Modified Continuous Read Mode Bit settings
Updated Ordering Information
Added Security Register 0 Note.
Add note 2b.
Typo M6-5 to W6-5
QE pin to QE bit
C
08/07/09
44, 45
5, 6, 8, 64~69, 70
and 71
52
Updated Erase/Program Suspend, Resume
Description.
Update Package Diagrams
Added Package WSON8 8x6-mm
Added Special Order context.
UID Waveform Correction
D
10/07/09
Table of Contents Error Correction
E
07/08/10
57 & 61
Updated AC parameters
Preliminary Designation
The “Preliminary” designation on a Winbond datasheet indicates that the product is not fully
characterized. The specifications are subject to change and are not guaranteed. Winbond or an
authorized sales representative should be consulted for current information before using this product.
Trademarks
Winbond and SpiFlash are trademarks of Winbond Electronics Corporation.
All other marks are the property of their respective owner.
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components in systems
or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship
instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for
other applications intended to support or sustain life. Further more, Winbond products are not intended
for applications wherein failure of Winbond products could result or lead to a situation wherein personal
injury, death or severe property or environmental damage could occur.
Winbond customers using or selling these products for use in such applications do so at their own risk
and agree to fully indemnify Winbond for any damages resulting from such improper use or sales.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W25Q32DW | 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI |
| W25Q32DWSFIG | 功能描述:IC FLASH SPI 32MBIT 16SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:2,500 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:1K (128 x 8) 速度:100kHz 接口:UNI/O?（单线） 电源电压:1.8 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-TSSOP，8-MSOP（0.118"，3.00mm 宽） 供应商设备封装:8-MSOP 包装:带卷 (TR) |
| W25Q32DWSFIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI |
| W25Q32DWSSIG | 功能描述:IC FLASH SPI 32MBIT 8SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:2,500 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:1K (128 x 8) 速度:100kHz 接口:UNI/O?（单线） 电源电压:1.8 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-TSSOP，8-MSOP（0.118"，3.00mm 宽） 供应商设备封装:8-MSOP 包装:带卷 (TR) |
| W25Q32DWSSIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI |
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