参数资料
型号: W25Q32BWSNIP
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 4M X 8 SPI BUS SERIAL EEPROM, DSO8
封装: 0.150 INCH, GREEN, PLASTIC, SOIC-8
文件页数: 68/72页
文件大小: 2212K
代理商: W25Q32BWSNIP
W25Q32BW
- 70 -
13. ORDERING INFORMATION (1)
W 25Q 32B W xx(1)
W = Winbond
25Q = SpiFlash Serial Flash Memory with 4KB sectors, Dual/Quad I/O
32B = 32M-bit
W = 1.70V to 1.95V
SN = 8-pin SOIC 150-mil
ZP = 8-pad WSON 6x5mm
ZE = 8-pad WSON 8x6mm
SS = 8-pin SOIC 208-mil
SF = 16-pin SOIC 300-mil
I = Industrial (-40°C to +85°C)
G =
Green Package (Lead-free, RoHS Compliant, Halogen-free (TBBA), Antimony-Oxide-free Sb2O3)
P
=
Green package with Status Register OTP feature enabled
(2)
Notes:
1a. Only the 2
nd letter is used for the part marking; WSON package type ZP is not used for the part marking.
1b. The “W” prefix is not included on the part marking.
2a. Standard bulk shipments are in Tube (shape E). Please specify alternate packing method, such as Tape and Reel (shape
T) or Tray (shape S), when placing orders.
2b. For shipments with OTP feature enabled, please specify when placing orders.
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