参数资料
型号: W25Q32DWZPIG
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 256K X 16 SPI BUS SERIAL EEPROM, 7.5 ns, PDSO8
封装: 6 X 5 MM, GREEN, WSON-8
文件页数: 50/82页
文件大小: 1155K
代理商: W25Q32DWZPIG
W25Q32DW
- 54 -
/CS
CLK
Mode 0
Mode 3
0
1
IO
0
IO
1
IO
2
IO
3
ABh
Instruction
Mode 0
Mode 3
tRES1
Power-down current
Stand-by current
Figure 28b. Release Power-down Instruction (QPI Mode)
tRES2
/CS
CLK
DI
(IO
0)
DO
(IO
1)
Mode 0
Mode 3
0
1
2
3
4
5
6
7
Instruction (ABh)
High Impedance
8
9
29
30
31
3 Dummy Bytes
23
22
2
1
0
*
Mode 0
Mode 3
7
6
5
4
3
2
1
0
*
32
33
34
35
36
37
38
Device ID
Power-down current
Stand-by current
= MSB
*
Figure 28c. Release Power-down / Device ID Instruction (SPI Mode)
Power-down current
Stand-by current
Device ID
/CS
CLK
Mode 0
Mode 3
0
1
IO
0
IO
1
IO
2
IO
3
ABh
2
3
4
5
X
6
7
8
4
0
5
1
6
2
7
3
IOs switch from
Input to Output
Instruction
tRES2
Mode 0
Mode 3
X
3 Dummy Bytes
Figure 28d. Release Power-down / Device ID Instruction (QPI Mode)
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