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参数资料
| 型号： | W25Q32DWZPIG |
| 厂商： | WINBOND ELECTRONICS CORP |
| 元件分类： | PROM |
| 英文描述： | 256K X 16 SPI BUS SERIAL EEPROM, 7.5 ns, PDSO8 |
| 封装： | 6 X 5 MM, GREEN, WSON-8 |
| 文件页数： | 81/82页 |
| 文件大小： | 1155K |
| 代理商： | W25Q32DWZPIG |
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W25Q32DW
- 82 -
14. REVISION HISTORY
VERSION
DATE
PAGE
DESCRIPTION
A
11/11/09
New Create Preliminary
B
08/03/10
All
Updated QPI instruction diagrams
C
01/14/11
55
63
70-71
72
na
63
72-73
Updated instruction 90h description
Updated dummy clocks description & frequency
Updated ICC1, ICC2, Vin, Vin Waveform
Updated maximum frequency
Update VCC Range
Update Set Read Parameter (C0h)
Update parameters tCE & tCHDX
Preliminary Designation
The “Preliminary” designation on a Winbond datasheet indicates that the product is not fully
characterized. The specifications are subject to change and are not guaranteed. Winbond or an
authorized sales representative should be consulted for current information before using this product.
Trademarks
Winbond and SpiFlash are trademarks of Winbond Electronics Corporation.
All other marks are the property of their respective owner.
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components in systems
or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship
instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for
other applications intended to support or sustain life. Further more, Winbond products are not intended
for applications wherein failure of Winbond products could result or lead to a situation wherein personal
injury, death or severe property or environmental damage could occur.
Winbond customers using or selling these products for use in such applications do so at their own risk
and agree to fully indemnify Winbond for any damages resulting from such improper use or sales.
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PDF描述 |
|---|---|
| WF128K32N-150H1M | 512K X 8 FLASH 12V PROM MODULE, 150 ns, CHIP66 |
| WF128K32-200G4C | 512K X 8 FLASH 12V PROM MODULE, 200 ns, CQFP68 |
| WF128K16-120CC5 | 128K X 16 FLASH 5V PROM MODULE, 120 ns, DMA40 |
| WMF2M8-150DLI5A | 2M X 8 FLASH 5V PROM, 150 ns, CDSO44 |
| WS57C45-25T | 2K X 8 UVPROM, 25 ns, CDIP24 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| W25Q32DWZPIG TR | 制造商:Winbond Electronics Corp 功能描述:IC FLASH 32MBIT 104MHZ 8WSON |
| W25Q32DWZPIP | 制造商:WINBOND 制造商全称:Winbond 功能描述:1.8V 32M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI |
| W25Q32FVSFIG | 功能描述:IC FLASH SPI 32MBIT 16SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:72 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步 存储容量:4.5M（256K x 18） 速度:133MHz 接口:并联 电源电压:3.135 V ~ 3.465 V 工作温度:0°C ~ 70°C 封装/外壳:100-LQFP 供应商设备封装:100-TQFP（14x20） 包装:托盘 |
| W25Q32FVSSIG | 制造商:Winbond Electronics Corp 功能描述:Flash Serial-SPI 3V/3.3V 32Mbit 4M x 8bit 8.5ns 8-Pin SOIC 制造商:Winbond Electronics Corp 功能描述:32MB F VERSIOB SPI FLASH 制造商:Winbond Electronics Corp 功能描述:IC FLASH 32MBIT 104MHZ 8SOIC |
| W25Q32FVSSIG TR | 制造商:Winbond Electronics Corp 功能描述:IC FLASH 32MBIT 104MHZ 8SOIC |
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