参数资料
型号: W25Q80BVSFIG
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 1M X 8 SPI BUS SERIAL EEPROM, PDSO16
封装: 0.300 INCH, GREEN, PLASTIC, SOIC-16
文件页数: 66/72页
文件大小: 1878K
代理商: W25Q80BVSFIG
W25Q80BV
Publication Release Date: March 26, 2009
- 69 -
Preliminary - Revision A
12.4 16-Pin SOIC 300-mil (Package Code SF)
MILLIMETERS
INCHES
SYMBOL
MIN
MAX
MIN
MAX
A
2.36
2.64
0.093
0.104
A1
0.10
0.30
0.004
0.012
b
0.33
0.51
0.013
0.020
C
0.18
0.28
0.007
0.011
D
(3)
10.08
10.49
0.397
0.413
E
10.01
10.64
0.394
0.419
E1
(3)
7.39
7.59
0.291
0.299
e
(2)
1.27 BSC
0.050 BSC
L
0.39
1.27
0.015
0.050
0o
8o
0o
8o
y
---
0.076
---
0.003
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
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