参数资料
型号: W25Q80BVSFIG
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 1M X 8 SPI BUS SERIAL EEPROM, PDSO16
封装: 0.300 INCH, GREEN, PLASTIC, SOIC-16
文件页数: 69/72页
文件大小: 1878K
代理商: W25Q80BVSFIG
W25Q80BV
Publication Release Date: March 26, 2009
- 71 -
Preliminary - Revision A
13.1 Valid Part Numbers and Top Side Marking
The following table provides the valid part numbers for the W25Q80BV SpiFlash Memory. Please contact
Winbond for specific availability by density and package type. Winbond SpiFlash memories use an 11-
digit Product Number for ordering. However, due to limited space, the Top Side Marking on all packages
use an abbreviated 9-digit number.
PACKAGE TYPE
DENSITY
PRODUCT NUMBER
TOP SIDE MARKING
SN
SOIC-8 150mil
8M-bit
W25Q80BVSNIG
W25Q80BVSNIP
25Q80BVNIG
25Q80BVNIP
SS
SOIC-8 208mil
8M-bit
W25Q80BVSSIG
W25Q80BVSSIP
25Q80BVSIG
25Q80BVSIP
SF
SOIC-16 300mil
8M-bit
W25Q80BVSFIG
W25Q80BVSFIP
25Q80BVFIG
25Q80BVFIP
ZP
(1)
WSON-8 6x5mm
8M-bit
W25Q80BVZPIG
W25Q80BVZPIP
25Q80BVIG
25Q80BVIP
Note:
1. WSON package type ZP is not used in the top side marking.
相关PDF资料
PDF描述
W25X32AVZPIG 4M X 8 FLASH 2.7V PROM, PDSO8
W25X32AVSFIG 4M X 8 FLASH 2.7V PROM, PDSO16
W26L04AJ-12I 256K X 16 STANDARD SRAM, 12 ns, PDSO44
W26L04AH-10 256K X 16 STANDARD SRAM, 10 ns, PDSO44
W28A CERPAC, 28 LEAD
相关代理商/技术参数
参数描述
W25Q80BVSNAG 制造商:WINBOND 制造商全称:Winbond 功能描述:8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q80BVSNAP 制造商:WINBOND 制造商全称:Winbond 功能描述:8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q80BVSNIG 功能描述:IC SPI FLASH 8MBIT 8SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:2,000 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 异步 存储容量:256K (32K x 8) 速度:15ns 接口:并联 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:28-TSSOP(0.465",11.8mm 宽) 供应商设备封装:28-TSOP 包装:带卷 (TR) 其它名称:71V256SA15PZGI8
W25Q80BVSNIG TR 制造商:Winbond Electronics Corp 功能描述: 制造商:Winbond Electronics Corp 功能描述:IC FLASH 8MBIT 104MHZ 8SOIC
W25Q80BVSNIP 制造商:WINBOND 制造商全称:Winbond 功能描述:8M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI