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参数资料
| 型号： | W25X20-VSNI |
| 厂商： | WINBOND ELECTRONICS CORP |
| 元件分类： | PROM |
| 英文描述： | 2M X 1 FLASH 2.7V PROM, PDSO8 |
| 封装： | 0.150 INCH, PLASTIC, SOIC-8 |
| 文件页数： | 12/42页 |
| 文件大小： | 1198K |
| 代理商： | W25X20-VSNI |
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W25X10, W25X20, W25X40 AND W25X80
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Table of Contents-
1.
GENERAL DESCRIPTION ......................................................................................................... 4
2.
FEATURES ................................................................................................................................. 4
3.
PIN CONFIGURATION 150-MIL................................................................................................. 5
4.
PIN DESCRIPTION 150-MIL ...................................................................................................... 5
5.
PIN CONFIGURATION 208-MIL................................................................................................. 6
6.
PIN DESCRIPTION 208-MIL ...................................................................................................... 6
6.1
Package Types ............................................................................................................... 7
6.2
Chip Select (/CS) ............................................................................................................ 7
6.3
Serial Data Output (DO) ................................................................................................. 7
6.4
Write Protect (/WP) ......................................................................................................... 7
6.5
HOLD (/HOLD) ............................................................................................................... 7
6.6
Serial Clock (CLK) .......................................................................................................... 7
6.7
Serial Data Input / Output (DIO) ..................................................................................... 7
7.
BLOCK DIAGRAM ...................................................................................................................... 8
8.
FUNCTIONAL DESCRIPTION ................................................................................................... 9
8.1
SPI OPERATIONS ......................................................................................................... 9
8.1.1
SPI Modes........................................................................................................................9
8.1.2
Dual Output SPI ...............................................................................................................9
8.1.3
Hold Function ...................................................................................................................9
8.2
WRITE PROTECTION.................................................................................................. 10
8.2.1
Write Protect Features ...................................................................................................10
9.
CONTROL AND STATUS REGISTERS................................................................................... 11
9.1
STATUS REGISTER .................................................................................................... 11
9.1.1
BUSY .............................................................................................................................11
9.1.2
Write Enable Latch (WEL) ..............................................................................................11
9.1.3
Block Protect Bits (BP2, BP1, BP0)................................................................................11
9.1.4
Top/Bottom Block Protect (TB).......................................................................................11
9.1.5
Reserved Bits .................................................................................................................11
9.1.6
Status Register Protect (SRP)........................................................................................12
9.1.7
Status Register Memory Protection ................................................................................13
9.2
INSTRUCTIONS ........................................................................................................... 14
9.2.1
Manufacturer and Device Identification ..........................................................................14
9.2.2
Instruction Set
(1) ............................................................................................................15
9.2.3
Write Disable (04h).........................................................................................................16
9.2.4
Write Enable (06h) .........................................................................................................16
9.2.5
Read Status Register (05h) ............................................................................................17
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W25X20VSNIG | 功能描述:IC FLASH 2MBIT 75MHZ 8SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:1,000 系列:- 格式 - 存储器:RAM 存储器类型:移动 SDRAM 存储容量:256M（8Mx32） 速度:133MHz 接口:并联 电源电压:1.7 V ~ 1.95 V 工作温度:-40°C ~ 85°C 封装/外壳:90-VFBGA 供应商设备封装:90-VFBGA（8x13） 包装:带卷 (TR) 其它名称:557-1327-2 |
| W25X20VSNIG T&R | 制造商:Winbond Electronics Corp 功能描述:IC FLASH 2MBIT 75MHZ 8SOIC |
| W25X20VSNIG T&R | 功能描述:IC FLASH 2MBIT 75MHZ 8SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:1,000 系列:- 格式 - 存储器:RAM 存储器类型:移动 SDRAM 存储容量:256M（8Mx32） 速度:133MHz 接口:并联 电源电压:1.7 V ~ 1.95 V 工作温度:-40°C ~ 85°C 封装/外壳:90-VFBGA 供应商设备封装:90-VFBGA（8x13） 包装:带卷 (TR) 其它名称:557-1327-2 |
| W25X20VSNIZ | 制造商:WINBOND 制造商全称:Winbond 功能描述:1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI |
| W25X20VSSC | 制造商:WINBOND 制造商全称:Winbond 功能描述:1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI |
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