参数资料
| 型号： | XRT75L03DIV-F |
| 厂商： | Exar Corporation |
| 文件页数： | 131/134页 |
| 文件大小： | 0K |
| 描述： | IC LIU E3/DS3/STS-1 3CH 128LQFP |
| 标准包装： | 72 |
| 类型： | 线路接口装置（LIU） |
| 驱动器/接收器数： | 3/3 |
| 规程： | DS3，E3，STS-1 |
| 电源电压： | 3.135 V ~ 3.465 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 128-LQFP 裸露焊盘 |
| 供应商设备封装： | 128-LQFP（14x20） |
| 包装： | 托盘 |
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XRT75L03D
á
REV. 1.0.0
THREE CHANNEL E3/DS3/STS-1 LINE INTERFACE UNIT WITH SONET DESYNCHRONIZER
91
A detailed discussion on how to design with and configure the XRT75L03D such that the end-system will
meet these Intrinsic Jitter and Wander requirements.
In a SONET system, the relevant specification requirements for Intrinsic Jitter and Wander (within a DS3 signal
that is mapped into and then de-mapped from SONET) are listed below.
Telcordia GR-253-CORE Category I Intrinsic Jitter Requirements for DS3 Applications (Section 5.6), and
ANSI T1.105.03b-1997 - SONET Jitter at Network Interfaces - DS3 Wander Supplement
In general, there are three (3) sources of Jitter and Wander within an asynchronously-mapped DS3 signal that
the system designer must be aware of. These sources are listed below.
Mapping/De-Mapping Jitter
Pointer Adjustments
Clock Gapping
Each of these sources of jitter/wander will be defined and discussed in considerable detail within this Section.
In order to accomplish all of this, this particular section will discuss all of the following topics in details.
How DS3 data is mapped into SONET, and how this mapping operation contributes to Jitter and Wander
within this "eventually de-mapped" DS3 signal.
How this asynchronously-mapped DS3 data is transported throughout the SONET Network, and how
occurrences on the SONET network (such as pointer adjustments) will further contributes to Jitter and
Wander within the "eventually de-mapped" DS3 signal.
A review of the Category I Intrinsic Jitter Requirements (per Telcordia GR-253-CORE) for DS3 applications
A review of the DS3 Wander requirements per ANSI T1.105.03b-1997
A review of the Intrinsic Jitter and Wander Capabilities of the XRT75L03D in a typical system application
An in-depth discussion on how to design with and configure the XRT75L03D to permit the system to the
meet the above-mentioned Intrinsic Jitter and Wander requirements
NOTE: An in-depth discussion on SDH De-Sync Applications will be presented in the next revision of this data sheet.
9.2
MAPPING/DE-MAPPING JITTER/WANDER
Mapping/De-Mapping Jitter (or Wander) is defined as that intrinsic jitter (or wander) that is induced into a DS3
signal by the "Asynchronous Mapping" process.
This section will discuss all of the following aspects of
Mapping/De-Mapping Jitter.
How DS3 data is mapped into an STS-1 SPE
How frequency offsets within either the DS3 signal (being mapped into SONET) or within the STS-1 signal
itself contributes to intrinsic jitter/wander within the DS3 signal (being transported via the SONET network).
9.2.1
HOW DS3 DATA IS MAPPED INTO SONET
Whenever a DS3 signal is asynchronously mapped into SONET, this mapping is typically accomplished by a
PTE accepting DS3 data (from some remote terminal) and then loading this data into certain bit-fields within a
given STS-1 SPE (or Synchronous Payload Envelope).
At this point, this DS3 signal has now been
asynchronously mapped into an STS-1 signal. In most applications, the SONET Network will then take this
particular STS-1 signal and will map it into "higher-speed" SONET signals (e.g., STS-3, STS-12, STS-48, etc.)
and will then transport this asynchronously mapped DS3 signal across the SONET network, in this manner. As
this "asynchronously-mapped" DS3 signal approaches its "destination" PTE, this STS-1 signal will eventually
be de-mapped from this STS-N signal. Finally, once this STS-1 signal reaches the "destination" PTE, then this
asynchronously-mapped DS3 signal will be extracted from this STS-1 signal.
9.2.1.1
A Brief Description of an STS-1 Frame
In order to be able to describe how a DS3 signal is asynchronously mapped into an STS-1 SPE, it is important
to define and understand all of the following.
The STS-1 frame structure
相关PDF资料 |
PDF描述 |
|---|---|
| XRT75L03IV-F | IC LIU E3/DS3/STS-1 3CH 128LQFP |
| XRT75L04DIV-F | IC LIU E3/DS3/STS-1 4CH 176TQFP |
| XRT75L04IV-F | IC LIU E3/DS3/STS-1 4CH 176LQFP |
| XRT75L06DIB-F | IC LIU E3/DS3/STS-1 6CH 217BGA |
| XRT75L06IB-F | IC LIU E3/DS3/STS-1 6CH 217BGA |
相关代理商/技术参数 |
参数描述 |
|---|---|
| XRT75L03DIVTR | 功能描述:时钟合成器/抖动清除器 3CHNNEL E3/DS3/STS 1 SONET DE-SYNCH RoHS:否 制造商:Skyworks Solutions, Inc. 输出端数量: 输出电平: 最大输出频率: 输入电平: 最大输入频率:6.1 GHz 电源电压-最大:3.3 V 电源电压-最小:2.7 V 封装 / 箱体:TSSOP-28 封装:Reel |
| XRT75L03DIVTR-F | 功能描述:接口 - 专用 RoHS:否 制造商:Texas Instruments 产品类型:1080p60 Image Sensor Receiver 工作电源电压:1.8 V 电源电流:89 mA 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:BGA-59 |
| XRT75L03ES | 功能描述:时钟合成器/抖动清除器 3 CH T3/E3/STS1 LIU+JA 3.3V RoHS:否 制造商:Skyworks Solutions, Inc. 输出端数量: 输出电平: 最大输出频率: 输入电平: 最大输入频率:6.1 GHz 电源电压-最大:3.3 V 电源电压-最小:2.7 V 封装 / 箱体:TSSOP-28 封装:Reel |
| XRT75L03IV | 功能描述:外围驱动器与原件 - PCI 3CH E3/DS3/STS1 JITTER ATTENUATOR RoHS:否 制造商:PLX Technology 工作电源电压: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:FCBGA-1156 封装:Tray |
| XRT75L03IV-F | 功能描述:外围驱动器与原件 - PCI 3-Ch DS3, E3, STS-1 RoHS:否 制造商:PLX Technology 工作电源电压: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:FCBGA-1156 封装:Tray |
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