参数资料
| 型号： | XRT75L03DIV-F |
| 厂商： | Exar Corporation |
| 文件页数： | 37/134页 |
| 文件大小： | 0K |
| 描述： | IC LIU E3/DS3/STS-1 3CH 128LQFP |
| 标准包装： | 72 |
| 类型： | 线路接口装置（LIU） |
| 驱动器/接收器数： | 3/3 |
| 规程： | DS3，E3，STS-1 |
| 电源电压： | 3.135 V ~ 3.465 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 128-LQFP 裸露焊盘 |
| 供应商设备封装： | 128-LQFP（14x20） |
| 包装： | 托盘 |
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XRT75L03D
THREE CHANNEL E3/DS3/STS-1 LINE INTERFACE UNIT WITH SONET DESYNCHRONIZER
REV. 1.0.0
126
9.8.3
How does the XRT75L03D permit the user to comply with the SONET APS Recovery Time
requirements of 50ms (per Telcordia GR-253-CORE)?
Telcordia GR-253-CORE, Section 5.3.3.3 mandates that the "APS Completion" (or Recovery) time be 50ms or
less. Many of our customers interpret this particular requirement as follows.
"From the instant that an APS is initiated on a high-speed SONET signal, all lower-speed SONET traffic (which
is being transported via this "high-speed" SONET signal) must be fully restored within 50ms. Similarly, if the
"high-speed" SONET signal is transporting some PDH signals (such as DS1 or DS3, etc.), then those entities
that are responsible for acquiring and maintaining DS1 or DS3 frame synchronization (with these DS1 or DS3
data-streams that have been de-mapped from SONET) must have re-acquired DS1 or DS3 frame
synchronization within 50ms" after APS has been initiated."
The XRT75L03D was designed such that the DS3 signals that it receives from a SONET Mapper device and
processes will comply with the Category I Intrinsic Jitter requirements per Telcordia GR-253-CORE.
Reference 1 documents some APS Recovery Time testing, which was performed to verify that the Jitter
Attenuator blocks (within the XRT75L03D) device that permit it to comply with the Category I Intrinsic Jitter
Requirements (for DS3 Applications) per Telcordia GR-253-CORE, do not cause it to fail to comply with the
"APS Completion Time" requirements per Section 5.3.3.3 of Telcordia GR-253-CORE.
However, Table 3
presents a summary of some APS Recovery Time requirements that were documented within this test report.
Table 3,
NOTE: The APS Completion (or Recovery) time requirement is 50ms.
Configuring the XRT75L03D to be able to comply with the SONET APS Recovery Time Requirements of
50ms
Quite simply, the user can configure a given Jitter Attenuator block (associated with a given channel) to (1)
comply with the "APS Completion Time" requirements per Telcordia GR-253-CORE, and (2) also comply with
the "Category I Intrinsic Jitter Requirements per Telcordia GR-253-CORE (for DS3 applications) by making
sure that Bit 4 (SONET APS Recovery Time Disable Ch_n), within the Jitter Attenuator Control Register is set
to "0" as depicted below.
TABLE 33: MEASURED APS RECOVERY TIME AS A FUNCTION OF DS3 PPM OFFSET
DS3 PPM OFFSET (PER W&G ANT-20SE)
MEASURED APS RECOVERY TIME (PER LOGIC ANALYZER)
-99 ppm
1.25ms
-40ppm
1.54ms
-30 ppm
1.34ms
-20 ppm
1.49ms
-10 ppm
1.30ms
0 ppm
1.89ms
+10 ppm
1.21ms
+20 ppm
1.64ms
+30 ppm
1.32ms
+40 ppm
1.25ms
+99 ppm
1.35ms
相关PDF资料 |
PDF描述 |
|---|---|
| XRT75L03IV-F | IC LIU E3/DS3/STS-1 3CH 128LQFP |
| XRT75L04DIV-F | IC LIU E3/DS3/STS-1 4CH 176TQFP |
| XRT75L04IV-F | IC LIU E3/DS3/STS-1 4CH 176LQFP |
| XRT75L06DIB-F | IC LIU E3/DS3/STS-1 6CH 217BGA |
| XRT75L06IB-F | IC LIU E3/DS3/STS-1 6CH 217BGA |
相关代理商/技术参数 |
参数描述 |
|---|---|
| XRT75L03DIVTR | 功能描述:时钟合成器/抖动清除器 3CHNNEL E3/DS3/STS 1 SONET DE-SYNCH RoHS:否 制造商:Skyworks Solutions, Inc. 输出端数量: 输出电平: 最大输出频率: 输入电平: 最大输入频率:6.1 GHz 电源电压-最大:3.3 V 电源电压-最小:2.7 V 封装 / 箱体:TSSOP-28 封装:Reel |
| XRT75L03DIVTR-F | 功能描述:接口 - 专用 RoHS:否 制造商:Texas Instruments 产品类型:1080p60 Image Sensor Receiver 工作电源电压:1.8 V 电源电流:89 mA 最大功率耗散: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:BGA-59 |
| XRT75L03ES | 功能描述:时钟合成器/抖动清除器 3 CH T3/E3/STS1 LIU+JA 3.3V RoHS:否 制造商:Skyworks Solutions, Inc. 输出端数量: 输出电平: 最大输出频率: 输入电平: 最大输入频率:6.1 GHz 电源电压-最大:3.3 V 电源电压-最小:2.7 V 封装 / 箱体:TSSOP-28 封装:Reel |
| XRT75L03IV | 功能描述:外围驱动器与原件 - PCI 3CH E3/DS3/STS1 JITTER ATTENUATOR RoHS:否 制造商:PLX Technology 工作电源电压: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:FCBGA-1156 封装:Tray |
| XRT75L03IV-F | 功能描述:外围驱动器与原件 - PCI 3-Ch DS3, E3, STS-1 RoHS:否 制造商:PLX Technology 工作电源电压: 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:FCBGA-1156 封装:Tray |
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