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| 型号： | ZL2105EVK2 |
| 厂商： | Intersil |
| 文件页数： | 3/36页 |
| 文件大小： | 0K |
| 描述： | EVAL BOARD 2 ZL2105 |
| 标准包装： | 1 |
| 系列： | * |
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ZL2105
1. Electrical Characteristics
Table 1. Absolute Maximum Ratings
Voltage measured with respect to SGND. Operating beyond these limits may cause permanent damage to the device.
Functional operation beyond the Recommended Operating Conditions is not implied.
Parameter
DC Supply Voltage
Logic Supply Voltage
High Side Supply Voltage
High Side Boost Voltage
Switch Node Current
Internal Drive References
Internal 2.5 V Reference
Pin
VDDP, VDDS, VDR
VDDL
BST
BST - SW
SW
VR, VRA
V25
Comments
Optional
Sink or Source
Value
-0.3 to 17
-0.3 to 6.5
-0.3 to 25
-0.3 to 8
4.5
-0.3 to 6.5
-0.3 to 3
Unit
V
V
V
V
A
V
V
EN, MGN, PG, SDA, SCL, SA,
Logic I/O Voltage
SALRT, SS, DLY, SYNC,
VTRK, UVLO, V(0,1), ILIM,
-0.3 to 6.5
V
VSEN, CFG
Ground Differential
MOSFET Drive Reference
Current
Analog Reference Current
2.5 V Reference Current
Junction Temperature
Storage Temperature
DGND - SGND
PGND - SGND
VR
VRA
V25
–
–
±0.3
30
150
60
-55 to 150
-55 to 150
V
mA
mA
mA
°C
°C
Lead Temperature
All
Soldering, 10 s
300
°C
Table 2. Recommended Operating Conditions an d Thermal Information
Parameter
Input Supply Voltage Range, VDDP, VDDS
Logic Supply Voltage Range, VDDL
Internal Driver Supply, VDR
Symbol
VDDS tied to VR, VRA
VR, VRA floating
VDDL (optional)
VDR
Min
4.5
5
3.0
10
Typ
–
–
–
–
Max
5.5
14
5.5
14
Unit
V
V
V
V
Output Voltage Range
1
V OUT
0.54
–
5.5
V
Operating Junction Temperature Range
T J
-40
–
125
°C
Junction to Ambient Thermal Impedance
2
Θ JA
–
35
–
°C/W
Junction to Case Thermal Impedance
3
Θ JC
–
5
–
°C/W
Notes:
1. Includes margin
2. Θ JA is measured in free air with the device mounted on a multi-layer FR4 test board and the exposed metal pad
soldered to a low impedance ground plane using multiple vias.
3. For Θ JC , the “case” temperature is measured at the center of the exposed metal pad . See Figure 4 for thermal
derating.
3
FN6851.2
March 30, 2011
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