参数资料
型号: ZL50112GAG2
厂商: ZARLINK SEMICONDUCTOR INC
元件分类: 通信及网络
英文描述: SPECIALTY TELECOM CIRCUIT, PBGA552
封装: 35 X 35 MM, 1.27 MM, LEAD FREE, PLASTIC, BGA-552
文件页数: 30/113页
文件大小: 1923K
代理商: ZL50112GAG2
ZL50110/11/12/14
Data Sheet
23
Zarlink Semiconductor Inc.
* Not connected on ZL50112, ZL50110 and
ZL50114 - leave open circuit.
Not Connected on ZL50110 and ZL50114 -
leave open circuit.
Not Connected on ZL50114 - leave open
circuit.
N/C - Not Connected - leave open circuit.
* Internally Connected on ZL50112 - leave
open circuit.
IC - Internally Connected - leave open
circuit.
IC_GND - tie to ground
IC_VDD_IO - tie to VDD_IO
AC8
TEST_MODE[0]
AC9
JTAG_TDO
AC10
CPU_ADDR[4]
AC11
CPU_ADDR[9]
AC12
CPU_ADDR[16]
AC13
CPU_ADDR[22]
AC14
CPU_CLK
AC15
CPU_DREQ0
AC16
IC
AC17
CPU_DATA[10]
AC18
CPU_DATA[16]
AC19
CPU_DATA[21]
AC20
CPU_DATA[27]
AC21
M2_TXD[1]
AC22
M2_TXEN
AC23
M2_RXD[2]
AC24
M2_RXER
AC25
M2_CRS
AC26
M0_ACTIVE_LED
AD1
RAM_DATA[34]
AD2
RAM_DATA[36]
AD3
RAM_DATA[41]
AD4
RAM_DATA[47]
AD5
RAM_DATA[53]
AD6
RAM_DATA[58]
AD7
RAM_DATA[63]
AD8
JTAG_TCK
AD9
IC_GND
AD10
CPU_ADDR[7]
AD11
CPU_ADDR[11]
AD12
CPU_ADDR[17]
AD13
CPU_ADDR[21]
AD14
CPU_WE
AD15
CPU_SDACK2
AD16
CPU_IREQ1
AD17
CPU_DATA[3]
AD18
CPU_DATA[6]
AD19
CPU_DATA[14]
Ball
Number
Signal Name
AD20
CPU_DATA[20]
AD21
CPU_DATA[24]
AD22
CPU_DATA[29]
AD23
M2_TXD[2]
AD24
M2_RXD[0]
AD25
M2_RXD[3]
AD26
M2_TXCLK
AE1
RAM_DATA[35]
AE2
RAM_DATA[40]
AE3
RAM_DATA[48]
AE4
RAM_DATA[54]
AE5
RAM_DATA[57]
AE6
RAM_DATA[62]
AE7
JTAG_TRST
AE8
IC_GND
AE9
CPU_ADDR[3]
AE10
CPU_ADDR[8]
AE11
CPU_ADDR[13]
AE12
CPU_ADDR[18]
AE13
CPU_ADDR[20]
AE14
CPU_OE
AE15
CPU_TS_ALE
AE16
CPU_DREQ1
AE17
IC
AE18
CPU_DATA[4]
AE19
CPU_DATA[9]
AE20
CPU_DATA[13]
AE21
CPU_DATA[18]
AE22
CPU_DATA[25]
AE23
CPU_DATA[28]
AE24
M2_TXD[0]
AE25
M2_TXD[3]
AE26
M2_COL
AF1
GND
AF2
RAM_DATA[50]
AF3
RAM_DATA[55]
AF4
RAM_DATA[56]
AF5
RAM_DATA[61]
Ball
Number
Signal Name
AF6
TEST_MODE[2]
AF7
JTAG_TDI
AF8
IC_GND
AF9
CPU_ADDR[5]
AF10
CPU_ADDR[10]
AF11
CPU_ADDR[15]
AF12
CPU_ADDR[19]
AF13
GND
AF14
CPU_CS
AF15
CPU_SDACK1
AF16
IC_VDD_IO
AF17
CPU_IREQ0
AF18
CPU_DATA[0]
AF19
CPU_DATA[5]
AF20
CPU_DATA[2]
AF21
CPU_DATA[11]
AF22
CPU_DATA[17]
AF23
CPU_DATA[19]
AF24
CPU_DATA[26]
AF25
CPU_DATA[31]
AF26
GND
Ball
Number
Signal Name
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相关代理商/技术参数
参数描述
ZL50114 制造商:ZARLINK 制造商全称:Zarlink Semiconductor Inc 功能描述:128, 256, 512 and 1024 Channel CESoP Processors
ZL50114GAG 制造商:Microsemi Corporation 功能描述:CESOP PROCESSOR 552BGA - Trays 制造商:MICROSEMI CONSUMER MEDICAL PRODUCT GROUP 功能描述:IC CESOP PROCESSOR 128CH 552PBGA 制造商:Microsemi Corporation 功能描述:IC CESOP PROCESSOR 128CH 552PBGA
ZL50114GAG2 制造商:Microsemi Corporation 功能描述:CESOP PROCESSOR 552BGA - Trays 制造商:MICROSEMI CONSUMER MEDICAL PRODUCT GROUP 功能描述:IC CESOP PROCESSOR 128CH 552PBGA 制造商:Microsemi Corporation 功能描述:IC CESOP PROCESSOR 128CH 552PBGA
ZL50115 制造商:ZARLINK 制造商全称:Zarlink Semiconductor Inc 功能描述:32, 64 and 128 Channel CESoP Processors
ZL50115GAG 制造商:Microsemi Corporation 功能描述:SWIT FABRIC 1K X 1K 1.8V/3.3V 324BGA - Trays 制造商:Microsemi Corporation 功能描述:IC CESOP PROCESSOR 32CH 324PBGA