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| 型号： | ZL50112GAG2 |
| 厂商： | ZARLINK SEMICONDUCTOR INC |
| 元件分类： | 通信及网络 |
| 英文描述： | SPECIALTY TELECOM CIRCUIT, PBGA552 |
| 封装： | 35 X 35 MM, 1.27 MM, LEAD FREE, PLASTIC, BGA-552 |
| 文件页数： | 41/113页 |
| 文件大小： | 1923K |
| 代理商： | ZL50112GAG2 |
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ZL50110/11/12/14
Data Sheet
33
Zarlink Semiconductor Inc.
3.3
Packet Interfaces
For the ZL50111 and ZL50112 variants the packet interface is capable of either 3 MII interfaces, 2 redundant GMII
interfaces or 2 redundant TBI (1000 Mbps) interfaces. The TBI interface is a PCS interface supported by an
integrated 1000BASE-X PCS module. The ZL50110 and ZL50114 variants have either 2 MII interfaces, 2 redundant
GMII interfaces or 2 redundant TBI (1000 Mbps) interfaces. When the packet interface is programmed for PCS/TBI
mode, by default the hardware will not enable auto-negotiation. The TBI auto-negotiation must be done by
application software. Ports 2 and 3 are not available on the ZL50110 and ZL50114 devices.
NOTE: In GMII/TBI mode only 1 GMAC port may be used to receive data. The second GMAC port is for
redundancy purposes only.
Data for all three types of packet switching is based on Specification IEEE Std. 802.3 - 2000. The table below
highlights the valid Ethernet interface combinations:
Note: Port 2 and Port 3 can not be used to receive data simultaneously, they are mutually exclusive for packet
reception. They may both be used for packet transmission if required.
The ZL50110/11/12/14 will not take action when receiving a PAUSE frame. It will not pause the transmission of
traffic. It is normally not required to stop CESoP traffic because it is generally constant bit rate and time sensitive. If
necessary, the limiting of egress non-CESoP traffic may be done external to the ZL50110/11/12/14 (e.g. in an
Ethernet switch).
Table 8 maps the signal pins used in the MII interface to those used in the GMII and TBI interface. Table 9 shows
MII Management Interface Package Ball Definition. Table 10, Table 11, Table 12, and Table 13 show respectively
the MII Port 0, Port 1, Port 2 and Port 3 Interface Package Ball Definition.
All Packet Interface signals are 5 V tolerant, and all outputs are high impedance while System Reset is LOW.
MII Port 0
MII Port 1
MII Port 2*
MII Port 3**
GE
GE***
--
GE
--
FE
--
GE
--
FE
--
FE
--
FE
--
FE
Note 1:
*ZL50111/112 only
Note 2:
**ZL50111 only
Note 3:
***Standby only
MII
GMII
TBI (PCS)
Mn_LINKUP_LED
Mn_ACTIVE_LED
-Mn_GIGABIT_LED
Mn_GIGABIT_LED
-Mn_REFCLK
Mn_REFCLK
Mn_RXCLK
Mn_RBC0
Table 8 - Packet Interface Signal Mapping - MII to GMII/TBI
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| ZL50114GAG | SPECIALTY TELECOM CIRCUIT, PBGA552 |
| ZL50232GD | DATACOM, ISDN ECHO CANCELLER, PBGA208 |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ZL50114 | 制造商:ZARLINK 制造商全称:Zarlink Semiconductor Inc 功能描述:128, 256, 512 and 1024 Channel CESoP Processors |
| ZL50114GAG | 制造商:Microsemi Corporation 功能描述:CESOP PROCESSOR 552BGA - Trays 制造商:MICROSEMI CONSUMER MEDICAL PRODUCT GROUP 功能描述:IC CESOP PROCESSOR 128CH 552PBGA 制造商:Microsemi Corporation 功能描述:IC CESOP PROCESSOR 128CH 552PBGA |
| ZL50114GAG2 | 制造商:Microsemi Corporation 功能描述:CESOP PROCESSOR 552BGA - Trays 制造商:MICROSEMI CONSUMER MEDICAL PRODUCT GROUP 功能描述:IC CESOP PROCESSOR 128CH 552PBGA 制造商:Microsemi Corporation 功能描述:IC CESOP PROCESSOR 128CH 552PBGA |
| ZL50115 | 制造商:ZARLINK 制造商全称:Zarlink Semiconductor Inc 功能描述:32, 64 and 128 Channel CESoP Processors |
| ZL50115GAG | 制造商:Microsemi Corporation 功能描述:SWIT FABRIC 1K X 1K 1.8V/3.3V 324BGA - Trays 制造商:Microsemi Corporation 功能描述:IC CESOP PROCESSOR 32CH 324PBGA |
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