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| 型号： | ZXMN6A08KTC |
| 厂商： | Diodes Inc |
| 文件页数： | 2/8页 |
| 文件大小： | 0K |
| 描述： | MOSFET N-CH 60V 5.36A DPAK |
| 标准包装： | 1 |
| FET 型： | MOSFET N 通道，金属氧化物 |
| FET 特点： | 逻辑电平门 |
| 漏极至源极电压(Vdss)： | 60V |
| 电流 - 连续漏极(Id) @ 25° C： | 5.36A |
| 开态Rds（最大）@ Id, Vgs @ 25° C： | 80 毫欧 @ 4.8A，10V |
| Id 时的 Vgs(th)（最大）： | 3V @ 250µA |
| 闸电荷(Qg) @ Vgs： | 5.8nC @ 10V |
| 输入电容 (Ciss) @ Vds： | 459pF @ 40V |
| 功率 - 最大： | 2.12W |
| 安装类型： | 表面贴装 |
| 封装/外壳： | TO-252-3，DPak（2 引线+接片），SC-63 |
| 供应商设备封装： | TO-252-3 |
| 包装： | 标准包装 |
| 产品目录页面： | 1473 (CN2011-ZH PDF) |
| 其它名称： | ZXMN6A08KTCDKR |
A Product Line of
Diodes Incorporated
ZXMN6A08K
Maximum Ratings
@T A = 25°C unless otherwise specified
Drain-Source voltage
Gate-Source voltage
Characteristic
(Note 3)
Symbol
V DSS
V GS
Value
60
± 20
7.90
Unit
V
V
Continuous Drain current
V GS = 10V
T A =70 ° C (Note 3)
I D
6.30
A
(Note 2)
5.36
Pulsed Drain current
V GS = 10V
(Note 4)
I DM
24.3
A
Continuous Source current (Body diode)
Pulsed Source current (Body diode)
(Note 3)
(Note 4)
I S
I SM
9.0
24.3
A
A
Thermal Characteristics @T A = 25°C unless otherwise specified
Characteristic
(Note 2)
Symbol
Value
4.13
33.0
Unit
Power dissipation
Linear derating factor
(Note 3)
P D
8.94
71.5
W
mW/ ° C
(Note 5)
(Note 2)
2.12
16.9
30.3
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Lead
Operating and storage temperature range
(Note 3)
(Note 5)
(Note 6)
R θ JA
R θ JL
T J , T STG
14.0
59.1
2.77
-55 to 150
° C/W
° C
Notes:
2. For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in still air conditions; the device is
measured when operating in a steady-state condition.
3. Same as note 2, except the device is measured at t ≤ 10 sec.
4. Same as note 2, except the device is pulsed with D = 0.02 and pulse width 300 μs. The pulse current is limited by the maximum junction temperature.
5. For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is
measured when operating in a steady-state condition.
6. Thermal resistance from junction to solder-point (at the end of the drain lead).
ZXMN6A08K
Document Revision: 2
2 of 8
www.diodes.com
July 2009
? Diodes Incorporated
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相关代理商/技术参数 |
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|---|---|
| ZXMN6A09DN8 | 制造商:Diodes Incorporated 功能描述:MOSFET DUAL N SO-8 |
| ZXMN6A09DN8(1) | 制造商:未知厂家 制造商全称:未知厂家 功能描述: |
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