参数资料
型号: AD9258BCPZ-125
厂商: Analog Devices Inc
文件页数: 4/44页
文件大小: 0K
描述: IC ADC 14BIT 125MSPS DL 64LFCSP
设计资源: High Performance, Dual Channel IF Sampling Receiver (CN0140)
标准包装: 1
位数: 14
采样率(每秒): 125M
数据接口: 串行
转换器数目: 2
功率耗散(最大): 788mW
电压电源: 模拟和数字
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 64-VFQFN 裸露焊盘,CSP
供应商设备封装: 64-LFCSP-VQ(9x9)
包装: 托盘
输入数目和类型: 2 个差分,单极
AD9258
Rev. A | Page 12 of 44
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
Rating
ELECTRICAL1
AVDD to AGND
0.3 V to +2.0 V
DRVDD to AGND
0.3 V to +2.0V
VIN+A/VIN+B, VINA/VINB to AGND
0.3 V to AVDD + 0.2 V
CLK+, CLK to AGND
0.3 V to AVDD + 0.2 V
SYNC to AGND
0.3 V to AVDD + 0.2 V
VREF to AGND
0.3 V to AVDD + 0.2 V
SENSE to AGND
0.3 V to AVDD + 0.2 V
VCM to AGND
0.3 V to AVDD + 0.2 V
RBIAS to AGND
0.3 V to AVDD + 0.2 V
CSB to AGND
0.3 V to DRVDD + 0.2 V
SCLK/DFS to AGND
0.3 V to DRVDD + 0.2 V
SDIO/DCS to AGND
0.3 V to DRVDD + 0.2 V
OEB
0.3 V to DRVDD + 0.2 V
PDWN
0.3 V to DRVDD + 0.2 V
D0A/D0B through D13A/D13B to
AGND
0.3 V to DRVDD + 0.2 V
DCOA/DCOB to AGND
0.3 V to DRVDD + 0.2 V
ENVIRONMENTAL
Operating Temperature Range
(Ambient)
40°C to +85°C
Maximum Junction Temperature
Under Bias
150°C
Storage Temperature Range
(Ambient)
65°C to +150°C
1 The inputs and outputs are rated to the supply voltage (AVDD or DRVDD) +
0.2 V but should not exceed 2.1 V.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the PCB
increases the reliability of the solder joints and maximizes the
thermal capability of the package.
Typical θJA is specified for a 4-layer PCB with a solid ground
plane. As shown in Table 7, airflow improves heat dissipation,
which reduces θJA. In addition, metal in direct contact with the
package leads from metal traces, through holes, ground, and
power planes, reduces θJA.
Table 7. Thermal Resistance
Package Type
Airflow
Velocity
(m/sec)
Unit
64-Lead LFCSP
(CP-64-6)
0
18.5
1.0
°C/W
1.0
16.1
9.2
°C/W
2.5
14.5
°C/W
1 Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.
2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
3 Per MIL-Std 883, Method 1012.1.
4 Per JEDEC JESD51-8 (still air).
ESD CAUTION
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