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参数资料
| 型号： | ADP1823ACPZ-R7 |
| 厂商： | Analog Devices Inc |
| 文件页数： | 26/32页 |
| 文件大小： | 0K |
| 描述： | IC REG CTRLR BUCK PWM VM 32LFCSP |
| 标准包装： | 1 |
| PWM 型： | 电压模式 |
| 输出数： | 2 |
| 频率 - 最大： | 720kHz |
| 占空比： | 90% |
| 电源电压： | 3.7 V ~ 20 V |
| 降压： | 是 |
| 升压： | 无 |
| 回扫： | 无 |
| 反相： | 无 |
| 倍增器： | 无 |
| 除法器： | 无 |
| Cuk： | 无 |
| 隔离： | 无 |
| 工作温度： | -40°C ~ 125°C |
| 封装/外壳： | 32-VFQFN 裸露焊盘，CSP |
| 包装： | 标准包装 |
| 产品目录页面： | 791 (CN2011-ZH PDF) |
| 其它名称： | ADP1823ACPZ-R7DKR |
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ADP1823
LFCSP CONSIDERATIONS
The LFCSP has an exposed die paddle on the bottom that
efficiently conducts heat to the PCB. To achieve the optimum
performance from the LFCSP, give special consideration to the
layout of the PCB. Use the following layout guidelines for the
LFCSP:
? The pad pattern is given in Figure 36. The pad dimension
should be followed closely for reliable solder joints while
maintaining reasonable clearances to prevent solder
bridging.
?
The paste mask for the thermal pad needs to be designed for
the maximum coverage to effectively remove the heat from
the package. However, due to the presence of thermal vias
and the large size of the thermal pad, eliminating voids may
not be possible. In addition, if the solder paste coverage is
too large, solder joint defects may occur. Therefore, it is
recommended to use multiple small openings over a single
big opening in designing the paste mask. The recommended
paste mask pattern is given in Figure 36. This pattern results
in about 80% coverage, which should not degrade the
thermal performance of the package significantly.
?
?
The thermal pad of the LFCSP provides a low thermal
impedance path to the PCB. Therefore, the PCB must be
properly designed to effectively conduct the heat away from
the package. This is achieved by adding thermal vias to the
PCB, which provide a thermal path to the inner or bottom
layers. See Figure 36 for the recommended via pattern. Note
that the via diameter is small, which prevents the solder
from flowing through the via and leaving voids in the
thermal pad solder joint.
Note that the thermal pad is attached to the die substrate;
therefore, the planes that the thermal pad is connected to
must be electrically isolated or connected to GND.
The solder mask opening should be about 120 microns
?
?
?
The recommended paste mask stencil thickness is 0.125 mm.
A laser cut stainless steel stencil with trapezoidal walls
should be used.
A no-clean, Type 3 solder paste should be used for mounting
the LFCSP. In addition, a nitrogen purge during the reflow
process is recommended.
The package manufacturer recommends that the reflow
temperature should not exceed 220°C and the time above
liquid is less than 75 seconds. The preheat ramp should be
3°C per second or lower. The actual temperature profile
depends on the board density; the assembly house must
determine what works best.
(4.7 mils) larger than the pad size, resulting in a minimum
60 microns (2.4 mils) clearance between the pad and the
solder mask.
?
The paste mask opening is typically designed to match the
pad size used on the peripheral pads of the LFCSP. This
technique should provide a reliable solder joint as long as
the stencil thickness is about 0.125 mm.
Rev. D | Page 26 of 32
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ADP1823-EVAL | 功能描述:BOARD EVAL FOR ADP1823 RoHS:否 类别:编程器，开发系统 >> 评估板 - DC/DC 与 AC/DC（离线）SMPS 系列:- 标准包装:1 系列:- 主要目的:DC/DC，步降 输出及类型:1，非隔离 功率 - 输出:- 输出电压:3.3V 电流 - 输出:3A 输入电压:4.5 V ~ 28 V 稳压器拓扑结构:降压 频率 - 开关:250kHz 板类型:完全填充 已供物品:板 已用 IC / 零件:L7981 其它名称:497-12113STEVAL-ISA094V1-ND |
| ADP1828 | 制造商:AD 制造商全称:Analog Devices 功能描述:Synchronous Buck PWM, Step-Down, DC-to-DC Controller |
| ADP1828ACPZ-R7 | 功能描述:IC REG CTRLR BUCK PWM VM 20LFCSP RoHS:是 类别:集成电路 (IC) >> PMIC - 稳压器 - DC DC 切换控制器 系列:- 标准包装:2,500 系列:- PWM 型:电流模式 输出数:1 频率 - 最大:500kHz 占空比:96% 电源电压:4 V ~ 36 V 降压:无 升压:是 回扫:无 反相:无 倍增器:无 除法器:无 Cuk:无 隔离:无 工作温度:-40°C ~ 125°C 封装/外壳:24-WQFN 裸露焊盘 包装:带卷 (TR) |
| ADP1828-BL1-EVZ | 制造商:Analog Devices 功能描述:BLANK ADISIMPOWER EVAL ADP1828 - Boxed Product (Development Kits) |
| ADP1828-BL2-EVZ | 制造商:Analog Devices 功能描述:BLANK ADISIMPOWER EVAL ADP1828 - Boxed Product (Development Kits) |
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