参数资料
型号: ADSP-BF504KCPZ-3F
厂商: Analog Devices Inc
文件页数: 23/80页
文件大小: 0K
描述: IC CCD SIGNAL PROCESSOR 88LFCSP
视频文件: Blackfin? BF50x Processor Family
标准包装: 1
系列: Blackfin®
类型: 定点
接口: CAN,EBI/EMI,I²C,IrDA,PPI,SPI,SPORT,UART/USART
时钟速率: 300MHz
非易失内存: 闪存(16MB)
芯片上RAM: 68kB
电压 - 输入/输出: 3.30V
电压 - 核心: 1.31V
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 88-VFQFN 裸露焊盘,CSP
供应商设备封装: 88-LFCSP(12x12)
包装: 托盘
Rev. A
|
Page 3 of 80
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July 2011
ADSP-BF504/ADSP-BF504F/ADSP-BF506F
GENERAL DESCRIPTION
The ADSP-BF50x processors are members of the Blackfin
fam-
ily of products, incorporating the Analog Devices/Intel Micro
Signal Architecture (MSA). Blackfin processors combine a dual-
MAC state-of-the-art signal processing engine, the advantages
of a clean, orthogonal RISC-like microprocessor instruction set,
and single-instruction, multiple-data (SIMD) multimedia capa-
bilities into a single instruction-set architecture.
The ADSP-BF50x processors are completely code compatible
with other Blackfin processors. ADSP-BF50x processors offer
performance up to 400 MHz and reduced static power con-
sumption. Differences with respect to peripheral combinations
are shown in Table 1.
By integrating a rich set of industry-leading system peripherals
and memory, Blackfin processors are the platform of choice for
next-generation applications that require RISC-like program-
mability, multimedia support, and leading-edge signal
processing in one integrated package.
PORTABLE LOW-POWER ARCHITECTURE
Blackfin processors provide world-class power management
and performance. They are produced with a low power and low
voltage design methodology and feature on-chip dynamic
power management, which provides the ability to vary both the
voltage and frequency of operation to significantly lower overall
power consumption. This capability can result in a substantial
reduction in power consumption, compared with just varying
the frequency of operation. This allows longer battery life for
portable appliances.
SYSTEM INTEGRATION
The ADSP-BF50x processors are highly integrated system-on-a-
chip solutions for the next generation of embedded industrial,
instrumentation, and power/motion control applications. By
combining industry-standard interfaces with a high perfor-
mance signal processing core, cost-effective applications can be
developed quickly, without the need for costly external compo-
nents. The system peripherals include a watchdog timer; two
32-bit up/down counters with rotary support; eight 32-bit tim-
ers/counters with PWM support; six pairs of 3-phase 16-bit
center-based PWM units; two dual-channel, full-duplex syn-
chronous serial ports (SPORTs); two serial peripheral interface
(SPI) compatible ports; two UARTs with IrDA
support; a par-
allel peripheral interface (PPI); a removable storage interface
(RSI) controller; an internal ADC with 12 channels, 12 bits, up
to 2 MSPS, and ACM controller; a controller area network
(CAN) controller; a 2-wire interface (TWI) controller; and an
internal 32M bit flash.
PROCESSOR PERIPHERALS
The ADSP-BF50x processors contain a rich set of peripherals
connected to the core via several high-bandwidth buses, provid-
ing flexibility in system configuration as well as excellent overall
system performance (see the block diagram on Page 1). These
Blackfin processors contain high-speed serial and parallel ports,
an interrupt controller for flexible management of interrupts
from the on-chip peripherals or external sources, and power
management control functions to tailor the performance and
power characteristics of the processor and system to many
application scenarios.
The SPORT, SPI, UART, PPI, and RSI peripherals are sup-
ported by a flexible DMA structure. There are also separate
memory DMA channels dedicated to data transfers between the
processor’s various memory spaces, including boot ROM and
internal 32M bit synchronous burst flash. Multiple on-chip
buses running at up to 100 MHz provide enough bandwidth to
keep the processor core running along with activity on all of the
on-chip and external peripherals.
The ADSP-BF50x processors include an interface to an off-chip
voltage regulator in support of the processor’s dynamic power
management capability.
Table 1. Processor Comparison
Feature
ADSP
-BF504
ADSP
-BF504F
ADSP
-BF506F
Up/Down/Rotary Counters
2
Timer/Counters with PWM
8
3-Phase PWM Units
2
SPORTs
2
SPIs
2
UARTs
2
Parallel Peripheral Interface
1
Removable Storage Interface
1
CAN
1
TWI
1
Internal 32M Bit Flash
1
ADC Control Module (ACM)
1
Internal ADC
1
GPIOs
35
Memor
y
(b
y
tes
) L1 Instruction SRAM
16K
L1 Instruction SRAM/Cache
16K
L1 Data SRAM
16K
L1 Data SRAM/Cache
16K
L1 Scratchpad
4K
L3 Boot ROM
4K
Maximum Speed Grade
1
1 For valid clock combinations, see Table 14, Table 15, Table 16, and Table 24
400 MHz
Maximum System Clock Speed
100 MHz
Package Options
88-Lead
LFCSP
88-Lead
LFCSP
120-Lead
LQFP
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