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参数资料
| 型号： | ADSP-BF537BBC-5A |
| 厂商： | Analog Devices Inc |
| 文件页数： | 45/68页 |
| 文件大小： | 0K |
| 描述： | IC DSP CTLR 16BIT 182CSPBGA |
| 产品培训模块： | Blackfin® Processor Core Architecture Overview Blackfin® Device Drivers Blackfin® Optimizations for Performance and Power Consumption Blackfin® System Services |
| 标准包装： | 1 |
| 系列： | Blackfin® |
| 类型： | 定点 |
| 接口： | CAN，SPI，SSP，TWI，UART |
| 时钟速率： | 500MHz |
| 非易失内存： | 外部 |
| 芯片上RAM： | 132kB |
| 电压 - 输入/输出： | 2.50V，3.30V |
| 电压 - 核心： | 1.26V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 182-LFBGA，CSPBGA |
| 供应商设备封装： | 182-CSPBGA（12x12） |
| 包装： | 托盘 |
| 配用： | ADZS-BF537-ASKIT-ND - BOARD EVAL SKIT ADSP-BF537 ADZS-BFAUDIO-EZEXT-ND - BOARD EVAL AUDIO BLACKFIN ADZS-BF537-EZLITE-ND - BOARD EVAL ADSP-BF537 ADZS-BFAV-EZEXT-ND - BOARD DAUGHT ADSP-BF533,37,61KIT ADZS-BF537-STAMP-ND - SYSTEM DEV FOR ADSP-BF537 |
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Rev. J
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Page 5 of 68
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February 2014
The address arithmetic unit provides two addresses for simulta-
neous dual fetches from memory. It contains a multiported
register file consisting of four sets of 32-bit index, modify,
length, and base registers (for circular buffering), and eight
additional 32-bit pointer registers (for C-style indexed stack
manipulation).
Blackfin processors support a modified Harvard architecture in
combination with a hierarchical memory structure. Level 1 (L1)
memories are those that typically operate at the full processor
speed with little or no latency. At the L1 level, the instruction
memory holds instructions only. The two data memories hold
data, and a dedicated scratchpad data memory stores stack and
local variable information.
In addition, multiple L1 memory blocks are provided, offering a
configurable mix of SRAM and cache. The memory manage-
ment unit (MMU) provides memory protection for individual
tasks that may be operating on the core and can protect system
registers from unintended access.
The architecture provides three modes of operation: user mode,
supervisor mode, and emulation mode. User mode has
restricted access to certain system resources, thus providing a
protected software environment, while supervisor mode has
unrestricted access to the system and core resources.
The Blackfin processor instruction set has been optimized so
that 16-bit opcodes represent the most frequently used instruc-
tions, resulting in excellent compiled code density. Complex
DSP instructions are encoded into 32-bit opcodes, representing
fully featured multifunction instructions. Blackfin processors
support a limited multi-issue capability, where a 32-bit instruc-
tion can be issued in parallel with two 16-bit instructions,
allowing the programmer to use many of the core resources in a
single instruction cycle.
The Blackfin processor assembly language uses an algebraic syn-
tax for ease of coding and readability. The architecture has been
optimized for use in conjunction with the C/C++ compiler,
resulting in fast and efficient software implementations.
MEMORY ARCHITECTURE
The ADSP-BF534/ADSP-BF536/ADSP-BF537 processors view
memory as a single unified 4G byte address space, using 32-bit
addresses. All resources, including internal memory, external
memory, and I/O control registers, occupy separate sections of
this common address space. The memory portions of this
address space are arranged in a hierarchical structure to provide
a good cost/performance balance of some very fast, low latency
on-chip memory as cache or SRAM, and larger, lower cost, and
performance off-chip memory systems. (See Figure 3).
The on-chip L1 memory system is the highest performance
memory available to the Blackfin processor. The off-chip mem-
ory system, accessed through the external bus interface unit
(EBIU), provides expansion with SDRAM, flash memory, and
SRAM, optionally accessing up to 516M bytes of
physical memory.
The memory DMA controller provides high bandwidth data-
movement capability. It can perform block transfers of code or
data between the internal memory and the external
memory spaces.
Internal (On-Chip) Memory
The ADSP-BF534/ADSP-BF536/ADSP-BF537 processors have
three blocks of on-chip memory providing high-bandwidth
access to the core.
The first block is the L1 instruction memory, consisting of
64K bytes SRAM, of which 16K bytes can be configured as a
four-way set-associative cache. This memory is accessed at full
processor speed.
The second on-chip memory block is the L1 data memory, con-
sisting of up to two banks of up to 32K bytes each. Each memory
bank is configurable, offering both cache and SRAM functional-
ity. This memory block is accessed at full processor speed.
The third memory block is a 4K byte scratchpad SRAM, which
runs at the same speed as the L1 memories, but is only accessible
as data SRAM, and cannot be configured as cache memory.
External (Off-Chip) Memory
External memory is accessed via the EBIU. This 16-bit interface
provides a glueless connection to a bank of synchronous DRAM
(SDRAM) as well as up to four banks of asynchronous memory
devices including flash, EPROM, ROM, SRAM, and memory
mapped I/O devices.
The PC133-compliant SDRAM controller can be programmed
to interface to up to 128M bytes of SDRAM. A separate row can
be open for each SDRAM internal bank, and the SDRAM con-
troller supports up to 4 internal SDRAM banks, improving
overall performance.
The asynchronous memory controller can be programmed to
control up to four banks of devices with very flexible timing
parameters for a wide variety of devices. Each bank occupies a
1M byte segment regardless of the size of the devices used, so
that these banks are only contiguous if each is fully populated
with 1M byte of memory.
I/O Memory Space
The ADSP-BF534/ADSP-BF536/ADSP-BF537 processors do
not define a separate I/O space. All resources are mapped
through the flat 32-bit address space. On-chip I/O devices have
their control registers mapped into memory-mapped registers
(MMRs) at addresses near the top of the 4G byte address space.
These are separated into two smaller blocks, one which contains
the control MMRs for all core functions, and the other which
contains the registers needed for setup and control of the on-
chip peripherals outside of the core. The MMRs are accessible
only in supervisor mode and appear as reserved space to on-
chip peripherals.
Booting
The Blackfin processor contains a small on-chip boot kernel,
which configures the appropriate peripheral for booting. If the
Blackfin processor is configured to boot from boot ROM
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ADSP-BF537BBC-5AV | 制造商:Rochester Electronics LLC 功能描述: 制造商:Analog Devices 功能描述: |
| ADSP-BF537BBCZ-5A | 功能描述:数字信号处理器和控制器 - DSP, DSC Blackfin processor 500MHz 132KB SRAM RoHS:否 制造商:Microchip Technology 核心:dsPIC 数据总线宽度:16 bit 程序存储器大小:16 KB 数据 RAM 大小:2 KB 最大时钟频率:40 MHz 可编程输入/输出端数量:35 定时器数量:3 设备每秒兆指令数:50 MIPs 工作电源电压:3.3 V 最大工作温度:+ 85 C 封装 / 箱体:TQFP-44 安装风格:SMD/SMT |
| ADSP-BF537BBCZ-5A | 制造商:Analog Devices 功能描述:Digital Signal Processor IC |
| ADSP-BF537BBCZ-5AV | 功能描述:IC DSP CTLR 16BIT 182CSPBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - DSP（数字式信号处理器） 系列:Blackfin® 标准包装:2 系列:StarCore 类型:SC140 内核 接口:DSI，以太网，RS-232 时钟速率:400MHz 非易失内存:外部 芯片上RAM:1.436MB 电压 - 输入/输出:3.30V 电压 - 核心:1.20V 工作温度:-40°C ~ 105°C 安装类型:表面贴装 封装/外壳:431-BFBGA，FCBGA 供应商设备封装:431-FCPBGA（20x20） 包装:托盘 |
| ADSP-BF537BBCZ-5AV | 制造商:Analog Devices 功能描述:Digital Signal Processor IC |
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