参数资料
型号: ADSP-TS101SAB1-000
厂商: ANALOG DEVICES INC
元件分类: 数字信号处理
英文描述: 300 MHz TigerSHARC Processor with 6 Mbit on-chip SRAM; Package: 625 ball BGA; No of Pins: 625; Temperature Range: Ind
中文描述: 64-BIT, 125 MHz, OTHER DSP, PBGA625
封装: 27 X 27 MM, PLASTIC, MS-034, BGA-625
文件页数: 39/48页
文件大小: 679K
代理商: ADSP-TS101SAB1-000
Rev. C
|
Page 44 of 48
|
May 2009
ADSP-TS101S
SURFACE-MOUNT DESIGN
The following table is provided as an aide to PCB design.
For industry-standard design recommendations, refer to
IPC-7351, Generic Requirements for Surface-Mount Design
and Land Pattern Standard.
Figure 44. 625-Ball PBGA (B-625)
1.00
BSC
SQ
BALL
PITCH
0.70
0.60
0.50
BALL DIAMETER
24.20
24.00
23.80
2.50 MAX
DETAIL A
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. THE ACTUAL POSITION OF THE BALL GRID IS WITHIN 0.25 mm OF ITS
IDEAL POSITION RELATIVE TO THE PACKAGE EDGES.
3. CENTER DIMENSIONS ARE NOMINAL.
4. THIS PACKAGE COMPLIES WITH THE JEDEC MS-034 SPECIFICATION,
BUT USES TIGHTER TOLERANCES THAN THE MAXIMUMS ALLOWED IN
THAT SPECIFICATION.
SEATING PLANE
1.25 MAX
0.20 MAX
DETAIL A
0.65
0.55
0.45
0.40 MIN
27.20
27.00 SQ
26.80
7
95
3
1
11
13
15
17
21 19
23
25
6
8
10
12
14
16
18
20
24 22
42
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
Y
W
V
U
T
AE
AD
AC
AB
AA
24.00
BSC
SQ
24.20
24.00
23.80
27.20
27.00
26.80
27.20
27.00
26.80
TOP VIEW
BOTTOM VIEW
1.50
BSC
SQ
1.50
BSC
SQ
Package
Ball Attach Type
Solder Mask Opening
Ball Pad Size
625-ball (27 mm) PBGA
Solder Mask Defined (SMD)
0.45 mm diameter
0.60 mm diameter
484-ball (19 mm) PBGA
Solder Mask Defined (SMD)
0.40 mm diameter
0.53 mm diameter
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