
Fusion Family of Mixed Signal FPGAs
Revision 4
2-121
Temperature Monitor Using Analog Pad AT
External
Temperature
Monitor
(external diode
2N3904,
TJ = 25°C)4
Resolution
8-bit ADC
4
°C
10-bit ADC
1
°C
12-bit ADC
0.25
°C
Systematic Offset5
AFS090 uncalibrated7
5°C
AFS090, AFS250, calibrated7
0°C
AFS250, AFS600, AFS1500,
uncalibrated7
11
°C
AFS600, AFS1500, calibrated7
0°C
Accuracy
±3
±5
°C
External Sensor Source
Current
High level, TMSTBx = 0
10
A
Low level, TMSTBx = 1
100
A
Max Capacitance on AT
pad
1.3
nF
Internal
Temperature
Monitor
Resolution
8-bit ADC
4
°C
10-bit ADC
1
°C
12-bit ADC
0.25
°C
Systematic Offset5
AFS090 uncalibrated7
5°C
AFS090, AFS250, calibrated7
0°C
AFS250, AFS600, AFS1500
uncalibrated7
11
°C
AFS600, AFS1500 calibrated7
0°C
Accuracy
±3
±5
°C
tTMSHI
Strobe High time
10
105
s
tTMSLO
Strobe Low time
5
s
tTMSSET
Settling time
5
s
Table 2-49 Analog Channel Specifications (continued)
Commercial Temperature Range Conditions, TJ = 85°C (unless noted otherwise),
Typical: VCC33A = 3.3 V, VCC = 1.5 V
Parameter
Description
Condition
Min.
Typ.
Max.
Units
Notes:
1. VRSM is the maximum voltage drop across the current sense resistor.
2. Analog inputs used as digital inputs can tolerate the same voltage limits as the corresponding analog pad. There is no
reliability concern on digital inputs as long as VIND does not exceed these limits.
3. VIND is limited to VCC33A + 0.2 to allow reaching 10 MHz input frequency.
4. An averaging of 1,024 samples (LPF setting in Analog System Builder) is required and the maximum capacitance
allowed across the AT pins is 500 pF.
5. The temperature offset is a fixed positive value.
6. The high current mode has a maximum power limit of 20 mW. Appropriate current limit resistors must be used, based on
voltage on the pad.
7. When using SmartGen Analog System Builder, CalibIP is required to obtain 0 offset. For further details on CalibIP, refer
to the "Temperature, Voltage, and Current Calibration in Fusion FPGAs" chapter of the Fusion FPGA Fabric User’s
Guide.