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参数资料
型号： AGLN010V5-UC36
元件分类： FPGA
英文描述： FPGA, 260 CLBS, 10000 GATES, 250 MHz, PBGA36
封装： 4 X 4 MM, 0.8 MM HEIGHT, 0.4 MM PITCH, UC-36
文件页数： 39/140页
文件大小： 4325K
代理商： AGLN010V5-UC36
Re vi s i on 10
4-1
4 – Datasheet Information
List of Changes
The following table lists critical changes that were made in each version of the IGLOO nano datasheet.
Revision
Changes
Page
Revision 10
(April 2010)
References to differential inputs were removed from the datasheet, since IGLOO
nano devices do not support differential inputs (SAR 21449).
N/A
A parenthetical note, "hold previous I/O state in Flash*Freeze mode," was added
to each occurrence of bus hold in the datasheet (SAR 24079).
N/A
The "In-System Programming (ISP) and Security" section was revised to add
1.2 V programming.
I
The note connected with the "IGLOO nano Ordering Information" table was
revised to clarify features not available for Z feature grade devices.
III
The "IGLOO nano Device Status" table is new.
II
The definition of C in the "Temperature Grade Offerings" table was changed to
"extended commercial temperature range."
IV
1.2 V wide range was added to the list of voltage ranges in the "I/Os with
Advanced I/O Standards" section.
1-8
A note was added to Table 2-2 Recommended Operating Conditions 1
regarding switching from 1.2 V to 1.5 V core voltage for in-system programming.
The VJTAG voltage was changed from "1.425 to 3.6" to "1.4 to 3.6" (SAR 24052).
The note regarding voltage for programming V2 and V5 devices was revised
(SAR 25213). The maximum value for VPUMP programming voltage (operation
mode) was changed from 3.45 V to 3.6 V (SAR 25220).
2-2
Table 2-6 Temperature and Voltage Derating Factors for Timing Delays
(normalized to TJ = 70°C, VCC = 1.425 V) and Table 2-7 Temperature and
Voltage Derating Factors for Timing Delays (normalized to TJ = 70°C,
VCC = 1.14 V) were updated. Table 2-8 Power Supply State per Mode is new.
2-6,
2-7
The tables in the "Quiescent Supply Current" section were updated (SAR 24882
and SAR 24112).
2-7
VJTAG was removed from Table 2-10 Quiescent Supply Current (IDD)
Characteristics, IGLOO nano Sleep Mode* (SARs 24112, 24882, and 79503).
2-8
The note stating what was included in IDD was removed from Table 2-11
Quiescent Supply Current (IDD) Characteristics, IGLOO nano Shutdown Mode.
The note, "per VCCI or VJTAG bank" was removed from Table 2-12 Quiescent
Supply Current (IDD), No IGLOO nano Flash*Freeze Mode1. The note giving IDD
was changed to "IDD = NBANKS * ICCI + ICCA."
2-8
The values in Table 2-13 Summary of I/O Input Buffer Power (per pin) – Default
I/O Software Settings and Table 2-14 Summary of I/O Output Buffer Power (per
pin) – Default I/O Software Settings1 were updated. Wide range support
information was added.
2-9
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相关代理商/技术参数
参数描述
AGLN010V5-UCG36 功能描述:IC FPGA 10K 1.5V UCG36 RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:IGLOO nano 标准包装:60 系列:XP LAB/CLB数:- 逻辑元件/单元数:10000 RAM 位总计:221184 输入/输出数:244 门数:- 电源电压:1.71 V ~ 3.465 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:388-BBGA 供应商设备封装:388-FPBGA（23x23） 其它名称:220-1241
AGLN010V5-UCG36I 功能描述:IC FPGA NANO 1KB 10K 36-UCSP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14）
AGLN015V2-QNG68 功能描述:IC FPGA NANO 1KB 15K 68-QFN RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14）
AGLN015V2-QNG68I 功能描述:IC FPGA NANO 1KB 15K 68-QFN RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14）
AGLN015V5-QNG68 功能描述:IC FPGA NANO 1KB 15K 68-QFN RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:IGLOO nano 标准包装:152 系列:IGLOO PLUS LAB/CLB数:- 逻辑元件/单元数:792 RAM 位总计:- 输入/输出数:120 门数:30000 电源电压:1.14 V ~ 1.575 V 安装类型:表面贴装 工作温度:-40°C ~ 85°C 封装/外壳:289-TFBGA，CSBGA 供应商设备封装:289-CSP（14x14）
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