参数资料
型号: AT89LP51-20PU
厂商: Atmel
文件页数: 40/117页
文件大小: 0K
描述: MCU 8051 4K FLASH 20MHZ
标准包装: 10
系列: 89LP
核心处理器: 8051
芯体尺寸: 8-位
速度: 20MHz
连通性: EBI/EMI,I²C,SPI,UART/USART
外围设备: 欠压检测/复位,POR,PWM,WDT
输入/输出数: 36
程序存储器容量: 4KB(4K x 8)
程序存储器类型: 闪存
RAM 容量: 256 x 8
电压 - 电源 (Vcc/Vdd): 2.4 V ~ 5.5 V
振荡器型: 内部
工作温度: -40°C ~ 85°C
封装/外壳: 40-DIP(0.600",15.24mm)
包装: 管件
29
3709D–MICRO–12/11
AT89LP51/52
6.
System Clock
The system clock is generated directly from one of three selectable clock sources. The three
sources are the on-chip crystal oscillator, external clock source, and internal RC oscillator. A dia-
gram of the clock subsystem is shown in Figure 6-1. The on-chip crystal oscillator may also be
configured for low or high power operation. The clock source is selected by the Clock Source
User Fuses as shown in Table 6-1. See “User Configuration Fuses” on page 86. By default, in
Fast mode no internal clock division is used to generate the CPU clock from the system clock. In
Compatibility mode the default is to divide the oscillator output by two. The system clock divider
may be used to prescale the system clock with other values. The choice of clock source also
affects the start-up time after a POR, BOD or Power-down event (See “Reset” on page 32 or
Figure 6-1.
Clock Subsystem Diagram
6.1
Crystal Oscillator
When enabled, the internal inverting oscillator amplifier is connected between XTAL1 and
XTAL2 for connection to an external quartz crystal or ceramic resonator. The oscillator may
operate in either high-power or low-power mode. Low-speed mode is intended for crystals of 12
MHz or less and consumes less power than the higher speed mode. The configuration as shown
in Figure 6-2 applies for both high and low power oscillators. Note that in some cases, external
capacitors C1 and C2 may NOT be required due to the on-chip capacitance of the XTAL1 and
XTAL2 inputs (approximately 10 pF each). When using the crystal oscillator, P4.6 and P4.7 will
have their inputs and outputs disabled. Also, XTAL2 in crystal oscillator mode should not be
used to directly drive a board-level clock without a buffer.
Table 6-1.
Clock Source Settings
Clock Source
Fuse 1
Clock Source
Fuse 0
Selected Clock Source
1
High Power Crystal Oscillator (f > 12 MHz)
1
0
Low Power Crystal Oscillator (f
≤12 MHz)
01
External Clock on XTAL1
0
Internal 1.8432 MHz Auxiliary Oscillator
CLK
osc
XTAL1
XTAL2
SYSTEM CLOCK
(CLKSYS)
INTERNAL
1.8432MHz
OSC
0
1
2
3
CLK
osc
/2
CLK
osc
/4
CLK
osc
/8
CLK
osc
/1
6
CLK
osc
/3
2
5-BIT
CLOCK
DIVIDER
CLKIRC
CLKEXT
CLKXTAL
0
12345
CDV2-0
CLOCK FUSES
4-BIT
PRESCALER
TPS3-0
Timer 0
Timer 1
Timer 2
Watchdog
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AT89LP51ED2-20AAU 功能描述:8位微控制器 -MCU 64KB 20MHz 2.4V-5.5V RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
AT89LP51ED2-20AU 功能描述:8位微控制器 -MCU 64KB 20MHz 2.4V-5.5V RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
AT89LP51ED2-20JU 功能描述:8位微控制器 -MCU 64KB 20MHz 2.4V-5.5V RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
AT89LP51ED2-20MU 功能描述:8位微控制器 -MCU 64KB 20MHz 2.4V-5.5V RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT
AT89LP51ED2-20PU 功能描述:8位微控制器 -MCU 64KB 20MHz 2.4V-5.5V RoHS:否 制造商:Silicon Labs 核心:8051 处理器系列:C8051F39x 数据总线宽度:8 bit 最大时钟频率:50 MHz 程序存储器大小:16 KB 数据 RAM 大小:1 KB 片上 ADC:Yes 工作电源电压:1.8 V to 3.6 V 工作温度范围:- 40 C to + 105 C 封装 / 箱体:QFN-20 安装风格:SMD/SMT