参数资料
型号: B80547RE061256
厂商: INTEL CORP
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 2530 MHz, MICROPROCESSOR, PBGA775
封装: FLIP CHIP, LGA-775
文件页数: 8/94页
文件大小: 2796K
代理商: B80547RE061256
16
Datasheet
Electrical Specifications
2.3.1
VCC Decoupling
Regulator solutions need to provide bulk capacitance with a low Effective Series Resistance (ESR)
and keep a low interconnect resistance from the regulator to the socket. Bulk decoupling for the
large current swings when the part is powering on, or entering/exiting low power states, must be
provided by the voltage regulator solution (VR). For more details, refer to the Voltage Regulator
Down (VRD) 10.1 Design Guide For Desktop LGA775 Socket.
2.3.2
FSB GTL+ Decoupling
The Celeron D processor in the 775-land package integrates signal termination on the die as well as
incorporating high frequency decoupling capacitance on the processor package. Decoupling must
also be provided by the system baseboard for proper GTL+ bus operation.
2.3.3
FSB Clock (BCLK[1:0]) and Processor Clocking
BCLK[1:0] directly controls the FSB interface speed as well as the core frequency of the processor.
As in previous generation processors, the Celeron D processor in the 775-land package core
frequency is a multiple of the BCLK[1:0] frequency. Refer to Table 2-1 for the Celeron D
processor in the 775-land package supported ratios.
The Celeron D processor in the 775-land package uses a differential clocking implementation. For
more information on the Celeron D processor in the 775-land package clocking, refer to the
CK410/CK410M Clock Synthesizer/Driver Specification.
Table 2-1. Core Frequency to FSB Multiplier Configuration
Multiplication of System Core
Frequency to FSB Frequency
Processor
Number
Core Frequency (133 MHz BCLK
/ 533 MHz FSB)
Notes1
NOTES:
1.
Individual processors operate only at or below the rated frequency.
1/19
325J/326
2.53 GHz
1/20
330J/331
2.66 GHz
1/21
335J/336
2.80 GHz
1/22
340J/341
2.93 GHz
1/23
345J/346
3.06 GHz
1/24
351
3.20 GHz
1/25
355
3.33 GHz
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