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| 型号： | B80547RE061256 |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 2530 MHz, MICROPROCESSOR, PBGA775 |
| 封装： | FLIP CHIP, LGA-775 |
| 文件页数： | 87/94页 |
| 文件大小： | 2796K |
| 代理商： | B80547RE061256 |
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88
Datasheet
Boxed Processor Specifications
7.3
Thermal Specifications
This section describes the cooling requirements of the fan heatsink solution used by the boxed
processor.
7.3.1
Boxed Processor Cooling Requirements
The boxed processor may be directly cooled with a fan heatsink. However, meeting the processor's
temperature specification is also a function of the thermal design of the entire system, and
ultimately the responsibility of the system integrator. For the processor temperature specification,
refer to Chapter 5. The boxed processor fan heatsink is able to keep the processor temperature
within the specifications listed in Table 5-1 for chassis that provide good thermal management. For
the boxed processor fan heatsink to operate properly, it is critical that the airflow provided to the
fan heatsink is unimpeded. Airflow of the fan heatsink is into the center and out of the sides of the
fan heatsink. Airspace is required around the fan to ensure that the airflow through the fan heatsink
is not blocked. Blocking the airflow to the fan heatsink reduces the cooling efficiency and
decreases fan life. Figure 7-7 and Figure 7-8 illustrate an acceptable airspace clearance for the fan
heatsink. The air temperature entering the fan should be kept below 38 °C. Again, meeting the
processor's temperature specification is the responsibility of the system integrator.
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