参数资料
型号: B80547RE061256
厂商: INTEL CORP
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 2530 MHz, MICROPROCESSOR, PBGA775
封装: FLIP CHIP, LGA-775
文件页数: 83/94页
文件大小: 2796K
代理商: B80547RE061256
84
Datasheet
Boxed Processor Specifications
7.1
Mechanical Specifications
7.1.1
Boxed Processor Cooling Solution Dimensions
This section documents the mechanical specifications of the boxed Celeron D processor in the
775- land package fan heatsink. The boxed processor will be shipped with an unattached fan
heatsink. Figure 7-1 shows a mechanical representation of the boxed Pentium 4 processor in the
775-land package.
Clearance is required around the fan heatsink to ensure unimpeded airflow for proper cooling. The
physical space requirements and dimensions for the boxed processor with assembled fan heatsink
are shown in Figure 7-2 (Side View), and Figure 7-3 (Top View). The airspace requirements for the
boxed processor fan heatsink must also be incorporated into new baseboard and system designs.
Airspace requirements are shown in Figure 7-7 and Figure 7-8. Note that some figures have
centerlines shown (marked with alphabetic designations) to clarify relative dimensioning.
Figure 7-2. Space Requirements for the Boxed Processor (Side View)
95.0
[3.74]
10.0
[0.39]
25.0
[0.98]
81.3
[3.2]
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