参数资料
型号: BX80532KC3000D
厂商: INTEL CORP
元件分类: 微控制器/微处理器
英文描述: 3000 MHz, MICROPROCESSOR
文件页数: 30/129页
文件大小: 1640K
代理商: BX80532KC3000D
Intel Xeon Processor with 512 KB L2 Cache
Datasheet
125
8.3
1U Rack Mount Server Solution
The 1U solution contains a passive heatsink and a foam pad, in addition to the retention solution
included with the other options. Because of the small form factor, the 1U heatsink is not as efficient
at dissipating heat as the general-purpose heatsink. In order to ensure maximum thermal efficiency,
the foam pad must be attached to the top of the 1U heatsink, blocking airflow between the heatsink
and the chassis cover. This will force air through the heatsink fins instead of allowing it to bypass
over the top. See Figure 51 and Figure 52 for more detail on installation.
Figure 51. Exploded View of the 1U Thermal Solution
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